Absolute Maximum Ratings
- DGND to GND-0.1V to +0.1V
- MBVDD to GND-0.3V to +5.5V
- MICBIAS to GND-0.3V to VMBVDD + 0.3V
- AVDD1 to GND-0.3V to +2.2V
- AVDD2 to GND-0.3V to +1.85V
- AVDD3 to DGND-0.3V to +1.85V
- AVDD1_REG to GND-0.3V to +1.85V
- DVDDIO to DGND-0.3V to +2.2V
- DVDD to DGND-0.3V to +1.85V
- INPn, INNn to GND-0.3V to VAVDD1 + 0.3V
- OUTP, OUTN to GND-0.3V to VAVDD1 + 0.3V
- MICBIASn to GND-0.3V to VMBVDD + 0.3V
- SCL, SDA, ADDR to DGND-0.3V to +2.2V
- All Other Pins-0.3V to VDVDDIO + 0.3V
- Short-Circuit of OUTP/OUTN and AVDDnContinuous
- Short-Circuit of OUTP/OUTN and AVDD1_REGContinuous
- Short-Circuit of OUTP/OUTN and GND/DGNDContinuous
- Short-Circuit of OUTP and OUTNContinuous
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, derate 21.87mW/°C above +70°C)1.75W
- Junction Temperature+150°C
- Operating Temperature Range-40°C to +85°C
- Storage Temperature Range-65°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.