Absolute Maximum Ratings

V_COREA, V_COREB-0.3V to +1.21V
V_CNN0, V_CNN1, V_CNN2, V_CNN3-0.3V to +1.21V
V_CNN0RAM, V_CNN1RAM, V_CNN2RAM, V_CNN3RAM-0.3V to +1.21V
V_USB0P9-0.3V to +1.21V
V_CSI2P5-0.3V to +2.75V
V_DDB (with respect to V_SSB)-0.3V to +3.6V
V_DDIO-0.3V to +1.89V
V_DDIOH-0.3V to +3.6V
V_BAT-0.3V to +3.6V
V_REGI-0.3V to +3.6V
V_DDA-0.3V to +1.89V
V_REF-0.3V to V_BAT + 0.3V
DM, DP (with respect to V_SSB)-0.3V to +3.6V
GPIO (V_DDIO)-0.3V to V_DDIO + 0.5V
RSTN, GPIO (V_DDIOH)-0.3V to V_DDIOH + 0.5V
32KIN, 32KOUT-0.3V to V_DDA + 0.2V
HFXIN, HFXOUT-0.3V to V_COREA + 0.2V
CSI_CKP, CSI_CKN, CSI_D0P, CSI_D0N, CSI_D1P, CSI_D1N-0.3V to V_CSI2P5
V_DDIO Combined Pins (sink)100mA
V_DDIOH Combined Pins (sink)100mA
V_SSA100mA
V_SS6A
V_SSPWR100mA
Output Current (sink) by any GPIO Pin25mA
Output Current (source) by any GPIO Pin-25mA
Continuous Package Power Dissipation CSBGA (multilayer board) T_A = +70°C (derate 39.37mW/°C above +70°C)(Note 1)3149.61mW
Operating Temperature Range-40°C to +105°C
Storage Temperature Range-65°C to +125°C
Soldering Temperature+260°C

Note 1:

Continuous Package Power Dissipation CSBGA can be exceeded with special cooling considerations.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.