PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNITS |
---|---|---|---|---|---|---|
GENERAL ELECTRICAL CHARACTERISTICS | ||||||
CHGIN Quiescent Current | ICHGIN | VCHGIN = 5.0V, SUSPEND pin digital high or MODE = 0, DEEP_SUSP_DIS = 1 | 0.19 | 0.38 | mA | |
VCHGIN = 5.0V, SUSPEND pin digital high or MODE = 0, DEEP_SUSP_DIS = 0 | 85 | μA | ||||
VCHGIN = 5.0V, VBATT = 4.2V, MODE = 5, DONE state (VSYS = 4.35V), ISYS = 0A | 2.35 | mA | ||||
Input Undervoltage Supply Current | IIN | VCHGIN = 2.4V, the input is undervoltage | 0.035 | mA | ||
BAT Quiescent Current | IBAT | VCHGIN = 0V, VBATT = 3.6V, QBATT FET is on, LPM = 0, ISYS = 0A | 29 | µA | ||
BAT Quiescent Current in Low-Power Mode | IBAT | VCHGIN = 0V, VBATT = 3.6V, QBATT FET is on, LPM = 1, ISYS = 0A | 22 | µA | ||
BAT Quiescent Current in Factory-Ship Mode | IBAT | VCHGIN = 0V, VBATT = 3.6V, QBATT FET is off, VSYS = VVDD = 0V, factory-ship mode | 3 | µA | ||
BAT Quiescent Current in Done State | IMBDN | VCHGIN = 5V, IBYP = 0A, VBATT = 4.2V, ISYS = 0A, QBATT FET is off, MODE = 5, done state | 7.5 | 10.5 | µA | |
SYS Operating Voltage | VSYS | Guaranteed by VSYS_UVLO_R and VSYS_OVLO_R | VSYS_UVLO_R | VSYS_OVLO_R | V | |
VIO Voltage Range | VVIO | 1.62 | 5.5 | V | ||
SCL, SDA Input Low Level | VSCL_SDA_IN_L | TA = +25°C | 0.3 x VVIO | V | ||
SCL, SDA Input High Level | VSCL_SDA_IN_H | TA = +25°C | 0.7 x VVIO | V | ||
SCL, SDA Input Hysteresis | VSCL_SDA_HYS | TA = +25°C | 0.05 x VVIO | V | ||
SCL, SDA Logic Input Current | ISCL_SDA | VSCL = VSDA = VVIO = 1.9V | -10 | +10 | µA | |
SDA Output Low Voltage | VSDA_OUT_L | ISDA = 20mA sinking | 0.4 | V | ||
IRQB Output Low Voltage | VIRQB_OUT_L | IIRQB = 1mA sinking | 0.4 | V | ||
IRQB Output High Leakage | IIRQB_H | VIRQB = 5.5V, TA = 2+5°C | -1 | 0 | +1 | μA |
VIRQB = 5.5V, TA = +85°C | 0.1 | |||||
CHGIN INPUT LIMITER | ||||||
CHGIN Operating Voltage Range | VCHGIN | VCHGIN must be less than VCHGIN_OVLO and greater than both VCHGIN_UVLO and (VSYS + VCHGIN2SYS_TH) for the charger to turn-on | VCHGIN_UVLO | VCHGIN_OVLO | V | |
CHGIN Overvoltage Threshold | VCHGIN_OVLO | VCHGIN rising | 19 | 19.5 | 20 | V |
CHGIN Overvoltage Threshold Hysteresis | VCHGIN_OVLO_HYS | 500 | mV | |||
CHGIN Undervoltage Threshold Setting Range | VCHGIN_UVLO | VCHGIN rising, 20% hysteresis, programmable at 4.7V, 4.8V, 4.9V, 5.05V | 4.7 | 5.05 | V | |
CHGIN Undervoltage Threshold Accuracy | VCHGIN_UVLO_ACC | VCHGIN rising, 4.7V setting | 4.6 | 4.7 | 4.8 | V |
CHGIN to SYS Undervoltage Threshold Rising | VCHGIN2SYS_TH | VCHGIN - VSYS, rising | 0.12 | 0.20 | 0.28 | V |
CHGIN Turn-On Threshold Validation Delay | tD-UVLO | Delay from VCHGIN > VCHGIN_UVLO to QCHGIN FET enable | 8 | ms | ||
CHGIN Switching Start Delay | tSTART | Delay from Input Validation to LX switching (if charge or buck mode is selected and charger is not suspended); see the Input Validation section for input validation conditions | 150 | ms | ||
CHGIN Adaptive Voltage Regulation Threshold Setting Range | VCHGIN_REG | Programmable at 4.5V, 4.6V, 4.7V, 4.85V. The input voltage regulation loop decreases the input current to regulate VCHGIN at VCHGIN_REG under weak input source conditions. If the input current is decreased to IIULO_DET and the input voltage is equal or below VCHGIN_REG, then the charger input is turned off. | 4.5 | 4.85 | V | |
CHGIN Adaptive Voltage Regulation Threshold Accuracy | VCHGIN_REG_ACC | 4.5V setting | 4.4 | 4.5 | 4.6 | V |
CHGIN Input Current Limit Setting Range | IINLIMIT | Programmable, 500mA default, 50mA step, production tested at 100mA, 500mA, 1000mA, 1800mA, and 3200mA settings only | 0.1 | 3.2 | A | |
CHGIN Input Current Limit Accuracy | IINLIMIT | Charger enabled, 500mA input current limit setting | 440 | 470 | 500 | mA |
Charger enabled, 1000mA input current limit setting | 880 | 940 | 1000 | |||
Charger enabled, 1800mA input current limit setting | 1584 | 1692 | 1800 | |||
Charger enabled, 3200mA input current limit setting | 2816 | 3008 | 3200 | |||
CHGIN Input Current Low Threshold | IIULO_DET | Charger enabled, 3200mA input current limit setting | 60 | mA | ||
SYSTEM BUCK | ||||||
Buck Output Voltage Setting Range (Tracking Disabled) | VSYSREG | Programmable 4.15V to 4.46V in 10mV steps (5-bits). Production tested at 4.2V only. | 4.15 | 4.46 | V | |
Buck Output Voltage Accuracy (Tracking Disabled) | VSYSREG_ACC | Buck only, charging disabled | -3 | +3 | % | |
Buck Output Voltage (Tracking Enabled) | VSYSREG_TRK_MIN | MODE = 4, SYS Tracking mode enabled, VBATT < VSYS_MIN/1.04 | 3.48 | 3.60 | 3.72 | V |
VSYSREG_TRK | MODE = 4, SYS Tracking mode enabled, VBATT ≥ VSYS_MIN/1.04, VSYSREG_TRK represented as a percentage of VBATT | 104 | % | |||
Buck Inductor Current Limit | IHSILIM | For MAX77976 | 8.5 | 9.5 | 10.5 | A |
IHSILIM | For MAX77975 | 5.95 | 7.00 | 8.05 | ||
Buck Minimum On Time | tON-MIN | Measured on LX | 100 | ns | ||
Buck Minimum Off Time | tOFF-MIN | Measured on LX | 100 | ns | ||
System Power-Up Current (from BYP) | ISYSPU_BYP | Charger present, VSYS < VSYS_UVLO_R | 50 | 75 | 100 | mA |
System Power-Up Time-Out (from BYP) | tSYSPU_BYP | 150 | ms | |||
CHARGER | ||||||
Precharge Charge Current | IPRECHG | VBATT < VPRECHG | 40 | 55 | 80 | mA |
Precharge Voltage Threshold | VPRECHG | VBATT rising | 2.4 | 2.5 | 2.6 | V |
Precharge Voltage Threshold Hysteresis | VPRECHG_HYS | 500 | mV | |||
Trickle Charge Current | ITRICKLE | TKEN = 1 by default, VPRECHG < VBATT < VTRICKLE | 270 | 300 | 330 | mA |
Trickle Charge Voltage Threshold | VTRICKLE | VBATT rising, TKEN = 1 by default | 3.0 | 3.1 | 3.2 | V |
Trickle Charge Voltage Threshold Hysteresis | VTRICKLE_HYS | TKEN = 1 by default | 100 | mV | ||
Prequalification Time | tPQ | Applies to the total time of precharge and trickle charge mode | 30 | min | ||
Fast-Charge Current Setting Range | IFC | 100mA to 5500mA in 50mA steps; production tested at 500mA, 1000mA, 3000mA, and 5000mA settings (MAX77976 only) | 0.1 | 5.5 | A | |
100mA to 3500mA in 50mA steps; production tested at 500mA, 1000mA, and 3000mA settings (MAX77975 only) | 0.1 | 3.5 | ||||
Fast-Charge Current Accuracy | IFC_ACC | Programmed IFC ≥ 500mA, VBATT > VSYSMIN, TA = +25°C | -3.5 | +3.5 | % | |
Programmed IFC ≥ 500mA, VBATT > VSYSMIN, TA = 0°C to +85°C | -6 | +6 | ||||
Programmed IFC ≥ 500mA, VTRICKLE < VBATT < VSYSMIN (LDO mode), TA = -5°C to +85°C | -10 | +10 | ||||
Fast-Charge Current Thermal Regulation Setting Range | TREG | Junction temperature when charge current starts to reduce for thermal regulation; programmable from +85°C to +130°C in 5°C steps; default value is +115°C | 85 | 130 | °C | |
Fast-Charge Current Thermal Regulation Gain | ATJREG | The charge current is decreased 5.73% of the fast-charge current full-scale for every degree that the junction temperature exceeds the thermal regulation temperature. This slope ensures that the full-scale current of 5.5A is reduced to 0A by the time the junction temperature is +17.5°C above the programmed loop set point. For lower programmed charge currents such as 480mA, this slope is valid for charge current reductions down to 80mA; below 100mA the slope becomes shallower but the charge current is reduced to 0A if the junction temperature is +20°C above the programmed loop set point. | -315 | mA/°C | ||
Fast-Charge Termination Voltage Setting Range | VBATTREG | Programmable from 4.15V to 4.46V in 10mV steps (5-bits); production tested at 4.2V and 4.35V only | 4.15 | 4.46 | V | |
Fast-Charge Termination Voltage Accuracy at Room Temp | VBATTREG_ACC | VBATTREG = 4.35V setting, represented as percentage of VBATTREG; TA = +25°C | -0.6 | -0.3 | +0.0 | % |
Fast-Charge Termination Voltage Accuracy | VBATTREG_ACC | VBATTREG = 4.35V setting, represented as percentage of VBATTREG; TA = -5°C to +85°C | -0.8 | -0.3 | +0.2 | % |
Fast-Charge Termination Debounce Time | tTERM | 30 | ms | |||
Fast-Charge Constant Current + Constant Voltage Safety Time | tFC | Adjustable from 3hrs, 4hrs, 5hrs, 6hrs, 7hrs, 8hrs including a disable setting; 5hrs default | 5 | hrs | ||
Top-Off Current Setting Range | ITO |
Programmable from 150mA to 850mA with 50mA in 16 steps; production tested at 150mA, 200mA, 500mA, and 850mA settings |
150 | 850 | mA | |
Top-Off Current Accuracy | ITO_ACC | 150mA setting | 122.5 | 177.5 | mA | |
200mA setting | 170 | 230 | ||||
500mA setting | 455 | 545 | ||||
850mA setting | 787.5 | 912.5 | ||||
Top-Off Time | tTO | Adjustable from 30sec to 70min in 10min steps; default setting is 30min | 30 | min | ||
Charge Restart Threshold Setting Range | VRSTRT | Adjustable at 100mV, 150mV, and 200mV; it can also be disabled | 100 | 150 | 200 | mV |
Charge Restart Debounce Time | tCRDG | 130 | ms | |||
Charge State Change Interrupt Debounce Time | tSCIDG | Excludes transition to timer fault state, watchdog timer state | 30 | ms | ||
Charge Watchdog Time | tWD | 80 | s | |||
Charge Timers Accuracy | tACC | -20 | +20 | % | ||
Charge-Overvoltage Threshold | VCOV | VBAT_SP - VBAT_SN, relative to VCHG_CV_PRM | 200 | mV | ||
Remote Sense BAT_SP Input Current in Charging Mode | IBAT_SP_CHG | VBATT_SP = VBATT = 3.8V, MODE = 5, TA = +25°C | 14 | μA | ||
Remote Sense BAT_SN Input Current in Charging Mode | IBAT_SN_CHG | VBATT_SN = 0, MODE = 5, TA = +25°C | 10 | μA | ||
SMART POWER SELECTOR | ||||||
System Regulation Voltage (Charging Enabled, Low Battery) | VSYSMIN | Charging enabled, VBATT < VSYSMIN - VSYSTRK | 3.492 | 3.600 | 3.708 | V |
VSYSTRK | Charging enabled, VSYSMIN - VSYSTRK < VBATT < VSYSMIN, measure of VSYS - VBATT | 0.45 | ||||
BATT to SYS Reverse Regulation Voltage | VBSREG | Measure of VSYS - VBATT; production tested at 10mA and 2A | -100 | mV | ||
SYS Self-Discharge Resistor | RSYSSD | Switching is disabled, QBATT FET is off, VSYS < VSYSUVLO_F | 600 | Ω | ||
SYSTEM POWER-UP | ||||||
System Power-Up Current (from BATT) | ISYSPU_BAT | VCHGIN = 0V | 35 | 50 | 80 | mA |
System Power-Up Voltage (from BATT) | VSYSPU_BAT | VSYS rising, 100mV hysteresis | 1.9 | 2.0 | 2.1 | V |
System Power-Up Time-Out (from BATT) | tSYSPU_BAT | 150 | ms | |||
REVERSE BOOST | ||||||
Reverse Boost Quiescent Current | VBYP = 5.1V, VBATT = 3.8V, MODE = 0x0A, VBYPSET = 0x1 | 2.5 | mA | |||
Reverse Boost Output Voltage Setting Range | VBYP_OTG | Measured on BYP pin, 2.5V < VBATT < 4.5V; adjustable from 5V to 12V with 0.1V step; production tested at 5V and 12V | 5 | 12 | V | |
Reverse Boost Output Voltage Accuracy | VBYP_ACC | Measured on BYP, MODE = 0x0A, VBYPSET = 0x1 | 4.95 | 5.10 | 5.25 | V |
Reverse Boost Inductor Current Limit | ILSILIM | For MAX77976 | 8.5 | 9.5 | 10.5 | A |
ILSILIM | For MAX77975 | 5.95 | 7.00 | 8.05 | ||
CHGIN OUTPUT LIMITER | ||||||
OTG Output Current Limit Setting Range (MAX77975) | ICHGIN_OTG_LIM | Configurable from 500mA to 2400mA in 100mA steps. Clamped to 12W power limit | 500 | 2400 | mA | |
OTG Output Current Limit Setting Range (MAX77976) | ICHGIN_OTG_LIM | Configurable from 500mA to 3100mA in 100mA steps. Clamped to 18W power limit | 500 | 3100 | mA | |
OTG Output Current Limit | ICHGIN_OTG_LIM | 3.4V < VBATT < 4.5V, OTG_ILIM = 0x00 | 500 | 537 | 575 | mA |
3.4V < VBATT < 4.5V, OTG_ILIM = 0x04 | 900 | 967 | 1035 | |||
3.4V < VBATT < 4.5V, OTG_ILIM = 0x0A | 1500 | 1612 | 1725 | |||
3.4V < VBATT < 4.5V, OTG_ILIM = 0x19 (MAX77975 only) | 2400 | 2580 | 2760 | |||
3.4V < VBATT < 4.5V, OTG_ILIM = 0x19 (MAX77976 only) | 3000 | 3225 | 3450 | |||
OTG Output Current Limit Alarm Time | tOTG_ALARM | Delay from OTG overcurrent event to BYP_I interrupt generated | 20 | ms | ||
OTG Output Current Limit Fault Time | tOTG_FAULT | Delay from OTG overcurrent event to QCHGIN FET opening | 30 | ms | ||
OTG Output Current Limit Retry Time | tOTG_RETRY | Delay from QCHGIN FET opening to QCHGIN FET closing again (OTG_REC_EN = 1) | 300 | ms | ||
SWITCHE IMPEDANCES AND LEAKAGE CURRENTS | ||||||
CHGIN to BYP On Resistance at Room Temp | RCHGIN2BYP_ROOM | CHGIN pin to BYP pin, TA = +25°C | 13.0 | 16.9 | mΩ | |
CHGIN to BYP On Resistance | RCHGIN2BYP | CHGIN pin to BYP pin, TA = -40°C to +85°C | 13.0 | 20.0 | mΩ | |
LX High-Side On Resistance at Room Temp | RHS_ROOM | BYP pin to LX pin, TA = +25°C | 31.0 | 43.4 | mΩ | |
LX High-Side On Resistance | RHS | BYP pin to LX pin, TA = -40°C to +85°C | 31.0 | 54.3 | mΩ | |
LX Low-Side On Resistance at Room Temp | RLS_ROOM | LX pin to PGND pin, TA = +25°C | 16.0 | 22.4 | mΩ | |
LX Low-Side On Resistance | RLS | LX pin to PGND pin, TA = -40°C to +85°C | 16.0 | 28.0 | mΩ | |
BATT to SYS On Resistance at Room Temp | RBAT2SYS_ROOM | BATT pin to SYS pin, VBATT = 4.4V, TA = +25°C | 7.70 | 11.05 | mΩ | |
BATT to SYS On Resistance | RBAT2SYS | BATT pin to SYS pin, VBATT = 4.4V, TA = -40°C to +85°C | 7.70 | 12.75 | mΩ | |
LX Leakage Current | ILX_LEAK | VLX = VPGND or VBYP, TA = +25°C | 0.01 | 10 | µA | |
VLX = VPGND or VBYP, TA = +85°C | 1 | |||||
BST Leakage Current | IBST_LEAK | VBST - VLX = 1.8V, TA = +25°C | 0.01 | 10 | µA | |
VBST - VLX = 1.8V, TA = +85°C | 1 | |||||
BYP Leakage Current | IBYP_LEAK | VBYP = 5.5V, VCHGIN = 0V, VLX = 0V, charger disabled, TA = +25°C | 0.01 | 10 | µA | |
VBYP = 5.5V, VCHGIN = 0V, VLX = 0V, charger disabled, TA = +85°C | 1 | |||||
BATSP Input Current Leakage | IBATSP | Charger disabled, VBATSP = VBATT, TA = +25°C | ±1 | μA | ||
BATSN Input Current Leakage | IBATSN | Charger disabled, VBATSN = VAGND, TA = +25°C | ±1 | μA | ||
LOGIC AND CONTROL I/Os | ||||||
Input Low Level | VIL | SUSPND, DISQBAT, TA = +25°C | 0.4 | V | ||
EXTSM, TA = +25°C | 0.3 x VBATT | |||||
Input High Level | VIH | SUSPND, DISQBAT, TA = +25°C | 1.4 | V | ||
EXTSM, TA = +25°C | 0.7 x VBATT | |||||
Input Leakage Current | ILK | SUSPND, DISQBAT, EXTSM pin, at 5.5V (including current through pulldown resistor) | 24 | 60 | µA | |
Output Low Voltage QBEXT | VOLQBEXT | Sourcing 1mA, TA = +25°C | 0.4 | V | ||
Output High Leakage QBEXT | ILQBEXT | VSYS = 5.5V, TA = +25°C | -1 | 0 | +1 | µA |
VSYS = 5.5V, TA = +85°C | 0.1 | |||||
SUSPND Internal Pulldown Resistor | RSUSPND | 235 | kΩ | |||
DISQBAT Internal Pulldown Resistor | RDISQBAT | 235 | kΩ | |||
EXTSM Internal Pulldown Resistor | REXTSM | 235 | kΩ | |||
EXTSM Debounce Time | tEXTSM_DEB | VBATT in 3.3V to 4.5V range, EXTSM_T = 0 | 10 | ms | ||
VBATT in 3.3V to 4.5V range, EXTSM_T = 1 | 0.1 | |||||
CHARGE STATUS INDICATOR | ||||||
Charge Status Current Setting Range | ISTAT_RNG | 5mA to 20mA in 5mA steps; production tested at VSTAT - VAGND = 1.0V and 5.0V | 5 | 20 | mA | |
Charge Status Current Accuracy | ISTAT_ACC | Production tested at 5mA and 20mA | -30 | +30 | % | |
THERMISTOR MONITOR | ||||||
THM Threshold, COLD | THM_COLD | VTHM/VPVDD rising, 1% hysteresis (thermistor temperature falling) | 73.8 | 75.0 | 76.2 | % |
THM Threshold, COOL | THM_COOL | VTHM/VPVDD rising, 1% hysteresis (thermistor temperature falling) | 64.3 | 65.5 | 66.7 | % |
THM Threshold, WARM | THM_WARM | VTHM/VPVDD falling, 1% hysteresis (thermistor temperature rising) | 30.8 | 32.0 | 33.2 | % |
THM Threshold, HOT | THM_HOT | VTHM/VPVDD falling, 1% hysteresis (thermistor temperature rising) | 20.8 | 22.0 | 23.2 | % |
THM Threshold, Disabled | THM_DIS | VTHM/VPVDD falling, 1% hysteresis, THM function is disabled below this voltage | 4.8 | 6.0 | 7.2 | % |
THM Threshold, Battery Removal Detection | THM_RM | VTHM/VPVDD rising, 1% hysteresis, battery removal | 85 | 87 | 89 | % |
THM Input Leakage Current | ILKTHM | VTHM = VAGND or VPVDD, charger disabled, TA = +25°C | 0.1 | 1 | µA | |
VTHM = VAGND or VPVDD, charger disabled, TA = +85°C | 0.1 | |||||
SUPPLIES AND MONITORING | ||||||
VDD Output Voltage | VVDD_1P8 | VSYS or VBATT = 3.8V, IVDD = 20mA | 1.71 | 1.80 | 1.89 | V |
SYS Undervoltage-Lockout Threshold (SYS Rising) | VSYS_UVLO_R | 2.74 | 2.80 | 2.86 | V | |
SYS Undervoltage-Lockout Threshold (SYS Falling) | VSYS_UVLO_F | 2.55 | 2.60 | 2.65 | V | |
SYS Undervoltage-Lockout Hysteresis | VSYS_UVLO_H | 200 | mV | |||
SYS Overvoltage-Lockout Threshold (SYS Rising) | VSYS_OVLO_R | SYS rising | 5.2 | 5.35 | 5.5 | V |
SYS Overvoltage-Lockout Threshold (SYS Falling) | VSYS_OVLO_F | SYS falling | 5 | 5.15 | 5.3 | V |
SYS Overvoltage-Lockout Hysteresis | VSYS_OVLO_H | 200 | mV | |||
Thermal Shutdown Threshold | TSHDN_R | Tj rising | 155 | °C | ||
Thermal Shutdown Threshold Hysteresis | TSHDN_H | 15 | °C | |||
PVDD Output Voltage | VPVDD_1P8 | VSYS = 3.8V, IPVDD = 20mA | 1.71 | 1.80 | 1.89 | V |
I2C-COMPATIBLE INTERFACE TIMING FOR STANDARD, FAST, AND FAST-MODE PLUS | ||||||
Clock Frequency | fSCL | 1000 | kHz | |||
Hold Time (Repeated) START Condition | tHD;STA | 0.26 | µs | |||
CLK Low Period | tLOW | 0.5 | µs | |||
CLK High Period | tHIGH | 0.26 | µs | |||
Set-Up Time Repeated START Condition | tSU;STA | 0.26 | µs | |||
DATA Hold Time | tHD:DAT | 0 | µs | |||
DATA Valid Time | tVD:DAT | 0.45 | µs | |||
DATA Valid Acknowledge Time | tVD:ACK | 0.45 | µs | |||
DATA Set-Up time | tSU;DAT | 50 | ns | |||
Set-Up Time for STOP Condition | tSU;STO | 0.26 | µs | |||
Bus-Free Time Between STOP and START | tBUF | 0.5 | µs | |||
Pulse Width of Spikes that must be Suppressed by the Input Filter | tSP | 50 | ns | |||
I2C-COMPATIBLE INTERFACE TIMING FOR HS-MODE (CB = 100pF) | ||||||
Clock Frequency | fSCL | 3.4 | MHz | |||
Set-Up Time Repeated START Condition | tSU;STA | 160 | ns | |||
Hold Time (Repeated) START Condition | tHD;STA | 160 | ns | |||
CLK Low Period | tLOW | 160 | ns | |||
CLK High Period | tHIGH | 60 | ns | |||
DATA Set-Up time | tSU;DAT | 10 | ns | |||
DATA Hold Time | tHD:DAT | 0 | ns | |||
Set-Up Time for STOP Condition | tSU;STO | 160 | ns | |||
Pulse Width of Spikes that must be Suppressed by the Input Filter | tSP | 10 | ns | |||
I2C-COMPATIBLE INTERFACE TIMING FOR HS-MODE (CB = 400pF) | ||||||
Clock Frequency | fSCL | 1.7 | MHz | |||
Set-Up Time Repeated START Condition | tSU;STA | 160 | ns | |||
Hold Time (Repeated) START Condition | tHD;STA | 160 | ns | |||
CLK Low Period | tLOW | 320 | ns | |||
CLK High Period | tHIGH | 120 | ns | |||
DATA Set-Up time | tSU;DAT | 10 | ns | |||
DATA Hold Time | tHD:DAT | 0 | ns | |||
Set-Up Time for STOP Condition | tSU;STO | 160 | ns | |||
Pulse Width of Spikes that must be Suppressed by the Input Filter | tSP | 10 | ns |