Absolute Maximum Ratings
- CHGIN to PGND-0.3V to +28V
- BYP to PGND-0.3V to +28V
- BYP to CHGIN-0.3V to +16V
- BYP to LX-0.3V to +28V
- LX to PGND-0.3V to +22V
- BST to PVDD-0.3V to +22V
- BST to LX-0.3V to +2.2V
- SYS to AGND-0.3V to +6.0V
- BATT to AGND-0.3V to +6.0V
- BATSP to AGND-0.3V to VBATT +0.3V
- BATSP to BATT-0.3V to +0.3V
- BATSN to AGND-0.3V to +0.3V
- PGND to AGND-0.3V to +0.3V
- DGND to AGND-0.3V to +0.3V
- PVDD to PGND-0.3V to +2.2V
- VDD to AGND-0.3V to +2.2V
- VIO to AGND-0.3V to +6.0V
- DISQBAT, SUSPEND, QBEXT to AGND-0.3V to +6.0V
- EXTSM to AGND-0.3V to VBATT +0.3V
- IRQB, STAT to AGND-0.3V to +6.0V
- THM to AGND-0.3V to VPVDD+0.3V
- SDA, SCL to AGND-0.3V to +6.0V
- CHGIN, BYP Continuous Current3.4ARMS
- LX, PGND Continuous Current5.7ARMS
- SYS, BATT Continuous Current10.0ARMS
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, deration is 35.34mW/°C above +70°C) mW to 2826.86mW
- Operating Temperature Range-40°C to +85°C
- Junction Temperature+150°C
- Storage Temperature Range-65°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.