Absolute Maximum Ratings
- CHGIN to GND-0.3V to +30.0V
- CSINP, CSINN to CHGIN-0.3V to +0.3V
- LX1 to PGND-0.3V to +30.0V
- LX2 to PGND-0.3V to +16.0V
- BST1 to PVL-0.3V to +30.0V
- BST2 to PVL-0.3V to +16.0V
- BST_ to LX-0.3V to +2.2V
- SYS, SYSA to GND-0.3V to +16.0V
- BATT to GND-0.3V to +16.0V
- SYS to BATT-0.3V to +16.0V
- BATSP to GND-0.3V to VBATT + 0.3V
- BATSN, PGND to GND-0.3V to +0.3V
- PVL, AVL, ISET, VSET, INLIM, ITO, CNFG, THM to GND-0.3V to +2.2V
- AVL to PVL-0.3V to +0.3V
- DISQBAT, OTGEN, STBY, STAT, INOKB, INTB, SDA, SCL to GND-0.3V to +6.0V
- CHGIN Continuous Current6.5ARMS
- LX_, PGND Continuous Current6.5ARMS
- SYS, BATT Continuous Current10.0ARMS
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, derate 40.37mW/°C above +70°C.)3229.71mW
- Operating Temperature Range-40°C to +85°C
- Junction Temperature+150°C
- Storage Temperature Range-65°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.