Package Code | W422D2+ 1 |
Outline Number | 21-100293 |
Land Pattern Number | Refer to Application Note 1891 |
Thermal Resistance, Four-Layer Board: | |
Junction to Ambient (θJA) | 44.11°C/W |
data-opMAX77932CEWO%2B
data-opMAX77932CEWO%2BT
The Power Input for the IC. Connect a 4.7μF capacitor between IN and PGND.Supply Input for Internal Gate Driver. Connect a 0.047μF bootstrap capacitor between BST1P and CF1P.Supply Input for Internal Gate Driver. Connect a 0.047μF bootstrap capacitor between BST1N and CF1N.Supply Input for Internal Gate Driver. Connect a 0.047μF bootstrap capacitor between BST2P and CF2P.Supply Input for Internal Gate Driver. Connect a 0.047μF bootstrap capacitor between BST2N and CF2N.Flying Capacitor Positive Terminal. Connecting 2 x 47μF capacitors between CF1P and CF1N is suggested.Flying Capacitor Negative TerminalFlying Capacitor Positive Terminal. Connecting 2 x 47μF capacitors between CF2P and CF2N is suggested.Flying Capacitor Negative TerminalSwitched Capacitor Converter Output. Connect 2 x 10μF capacitors between OUT and PGND.Power Ground Pin1.8V Linear Regulator Output. Bypass to PGND with a 1μF capacitor. Do not apply an external load.Linear Regulator Outputs VOUT + 1.8V. Bypass to OUT with a 1μF capacitor. Do not apply an external load.Analog Ground PinPower Good Indicator OutputActive-High Chip Enable InputDo Not ConnectInterrupt Output. Connect a 100kΩ pullup resistor between IRQB and VIO.I2C Interface Data I/OI2C Interface Clock InputI/O Supply Voltage Input. Bypass to AGND with a 1μF capacitor.