Absolute Maximum Ratings
- IN to PGND-0.3V to +16V
- BSTxP to PGND-0.3V to +16V
- BSTxN to PGND-0.3V to +8V
- BSTxP to CFxP-0.3V to +2V
- BSTxN to CFxN-0.3V to +2V
- CFxP to PGND-0.3V to VOUT + 6V
- CFxN to PGND-0.3V to +6V
- OUT to PGND-0.3V to +6V
- PGND to AGND-0.3V to +0.3V
- HVDD to AGND-0.3V to VOUT + 2V
- AVDD to AGND-0.3V to +2V
- EN to AGND-0.3V to +16V
- NC to AGND-0.3V to +2V
- IRQB to DGND-0.3V to +6V
- VIO to AGND-0.3V to +6V
- SDA to DGND-0.3V to VVIO + 0.3V
- SCL to DGND-0.3V to VVIO + 0.3V
- PGOOD to AGND-0.3V to +2.0V
- OUT Continuous RMS Current8A
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, derate 22.67mW/°C above +70°C)1813.64mW
- Operating Temperature Range-40°C to +85°C
- Junction Temperature+150°C
- Storage Temperature Range-65°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.