Absolute Maximum Ratings

Absolute Maximum Ratings
  • nIRQ, nRST to GND-0.3V to VSYS + 0.3V
  • nEN to GND (Note 1)-0.3V to VCCINT + 0.3V
  • SCL, SDA, GPIO to GND-0.3V to VIO + 0.3V
  • CHGIN to GND-0.3V to +30.0V
  • SYS, BATT to GND-0.3V to +6.0V
  • SYS to IN_SBB-0.3V to +0.3V
  • VL to GND-0.3V to +6.0V
  • AMUX, THM, TBIAS to GND-0.3V to +6.0V
  • nIRQ, nRST, SDA, AMUX, GPIO Continous Current±20mA
  • CHGIN Continuous Current1.2ARMS
  • SYS Continuous Current1.2ARMS
  • BATT Continuous Current (Note 2)1.2ARMS
  • LDO0, LDO1 to GND-0.3V to VIN_LDO + 0.3V
  • IN_LDO0, IN_LDO1, VIO to GND-0.3V to VSYS + 0.3V
  • IN_SBB to PGND-0.3V to +6.0V
  • LXA Continuous Current (Note 3)1.2ARMS
  • LXB Continuous Current (Note 3)1.2ARMS
  • SBB0, SBB1, SBB2 to PGND-0.3V to +6.0V
  • BST to IN_SBB-0.3V to +6.0V
  • BST to LXB-0.3V to +6.0V
  • SBB0, SBB1, SBB2 Short-Circuit DurationContinuous
  • PGND to GND-0.3V to +0.3V
  • Operating Temperature Range-40°C to +85°C
  • Junction Temperature+150°C
  • Storage Temperature Range-65°C to +150°C
  • Soldering Temperature (reflow)+260°C
  • Continuous Power Dissipation (Multilayer Board, TA = +70°C, derate 20.4mW/°C above +70°C)1632mW
Note 1: VCCINT is internally connected to either BATT or VL. See the nEN Internal Pullup Resistors to VCCINT section for more details.
Note 2: Do not repeatedly hot-plug a source to the BATT terminal at a rate greater than 10Hz. Hot plugging low impedance sources results in an ~8A momentary (~2μs) current spike.
Note 3: Do not externally bias LXA or LXB. LXA has internal clamping diodes to PGND and IN_SBB. LXB has an internal low-side clamping diode to PGND and an internal high-side clamping diode that dynamically connects to a selected SIMO output. It is normal for these diodes to briefly conduct during switching events. When the SIMO regulator is disabled, the LXB to PGND absolute maximum voltage is -0.3V to VSBB0 + 0.3V.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.