| Package Code | N60D1+1 |
| Outline Number | 21-100086 |
| Land Pattern Number | Refer to Application Note 1891 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | |
| Junction to Ambient (θJA) | 98°C/W |
| Package Code | U6+1 |
| Outline Number | 21-0058 |
| Land Pattern Number | 90-0175 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | |
| Junction to Ambient (θJA) | 230°C/W |
| Junction to Case (θJC) | 76°C/W |
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Note:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
data-opMAX40000AUT12%2B
data-opMAX40001ANT12%2BT
data-opMAX40000ANT12%2BT
data-opMAX40001ANT12%2B
data-opMAX40000ANT12%2B
data-opMAX40001AUT12%2B
data-opMAX40000AUT12%2BT
data-opMAX40001AUT12%2BT
data-opMAX40001AUT22%2BT
data-opMAX40001AUT22%2B
Inverting Input of ComparatorInternal Voltage Reference Output. Bypass REF pin with a 0.1μF capacitor to GND as close as possible to the device.GroundNoninverting Input of ComparatorVDD Supply Voltage. Bypass VDD with a 0.1μF capacitor to GND as close as possible to the device pin.Open-Drain Output (MAX40001)/Push-Pull Output (MAX40000). For the open-drain version, connect a 100kΩ pullup resistor from OUT to any pullup voltage up to 5.5V.