Absolute Maximum Ratings
- VDD to GND-0.3V to +6V
- REF to GND-0.3V to +6V
- IP, IM to GND-0.3V to +6V
- IP to IM±6V
- OUT (open-drain) to GND-0.3V to +6V
- OUT (push-pull) to GND-0.3V to VDD + 0.3V
- Output Short-Circuit Duration10s
- Continuous Current Into Any Input Pin20mA
- Continuous Current Into/Out of Any Output Pin50mA
- Continuous Power Dissipation (TA = +70°C) Maximum Power Dissipation (WLP, derate 10.2mW/°C above +70°C)816mW
- Maximum Power Dissipation (SOT23, derate 4.3mW/°C above +70°C)347.8mW
- Operating Temperature Range-40°C to +125°C
- Junction Temperature (TJMAX)+150°C
- Storage Temperature Range-65°C to +150°C
- Lead Temperature (soldering, 10s)+300°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.