Absolute Maximum Ratings- CAP, ENB, ENC, LX to GND-0.3V to +6V
- SYS, BKB, RDY to GND-0.3V to +6V
- FBCH, FBCR to GND-0.3V to CAP + 0.3V
- FBS, ISET to GND-0.3V to SYS + 0.3V
- PGND to GND-0.3V to +0.3V
- Continuous Power Dissipation (TA = +70°C, TQFN, derate 23.1mW/°C above +70°C)1847.6mW
- Operating Temperature Range-40°C to +125°C
- Storage Temperature Range-65°C to +150°C
- Maximum Junction Temperature+150°C
- Lead Temperature (soldering, 10 seconds)+300°C
- Soldering Temperature (reflow)+260°C
- LX RMS Current±5.0ARMS
- Output Short-Circuit DurationContinuous
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.