| Package Code | N60R1+1 |
| Outline Number | 21-100464 |
| Land Pattern Number | Refer to Application Note 1891 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | |
| Junction to Ambient (θJA) | 95.15°C/W |
| Junction to Case (θJC) | N/A |
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Regulator Supply Input Pin. Connect to a voltage between 1.8V and 5.5V and bypass with a 10µF capacitor from IN to GND.Switching Node Pin. Connect recommended inductor between LX and OUT.Ground Pin. Connect to application board GND.MAX38650A: Connect a resistor from RSEL to GND to program the output voltage and IN undervoltage threshold based onTable 1.MAX38650B: The pin is no connect since the device is preprogrammed and should be left floating.Output Voltage Pin. Connect to the load at a point where accurate regulation (output capacitor) is required to eliminate voltage drops.Enable Input Pin. Force this pin high to enable the buck converter. Force this pin low to disable the part and enter shutdown.