| PART NUMBER | TEMP RANGE | PIN-PACKAGE | DATA RATE | ENABLE |
|---|---|---|---|---|
| MAX33076EAEE+* | -40°C to +125°C | 16 QSOP | 20Mbps | G, |
| MAX33076EASE+ | -40°C to +125°C | 16 SOIC | 20Mbps | G, |
| MAX33077EAEE+* | -40°C to +125°C | 16 QSOP | 35Mbps | G, |
| MAX33077EASE+* | -40°C to +125°C | 16 SOIC | 35Mbps | G, |
| MAX33078EAEE+* | -40°C to +125°C | 16 QSOP | 20Mbps | EN12, EN34 |
| MAX33078EASE+* | -40°C to +125°C | 16 SOIC | 20Mbps | EN12, EN34 |
| MAX33079EAEE+* | -40°C to +125°C | 16 QSOP | 35Mbps | EN12, EN34 |
| MAX33079EASE+* | -40°C to +125°C | 16 SOIC | 35Mbps | EN12, EN34 |
*Future product—contact factory for availability.
+Denotes a lead(Pb)-free/RoHS-compliant package.