Absolute Maximum Ratings
- VCORE, HFXIN, HFXOUT-0.3V to +1.21V
- VDD, VDDA-0.3V to +3.63V
- VREF-0.3V to VDDA + 0.3V
- 32KIN, 32KOUT-0.3V to VDD + 0.3V
- RSTN, GPIO-0.3V to VDD + 0.3V
- Total Current into All GPIO Combined (sink)100mA
- VSS100mA
- Output Current (sink) by Any GPIO Pin25mA
- Output Current (source) by Any GPIO Pin-25mA
- Continuous Package Power Dissipation 40 TQFN-EP (multilayer board) TA = +70°C (derate 35.7mW/°C above +70°C)2857.10mW
- Continuous Package Power Dissipation 56 TQFN-EP (multilayer board) TA = +70°C (derate 40mW/°C above +70°C)3200mW
- Operating Temperature Range-40°C to +105°C
- Storage Temperature Range-65°C to +150°C
- Soldering Temperature (reflow)+260°C
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Note:
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No device pins can exceed 3.63V. All voltages with respect to VSS, unless otherwise noted. |
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.