Absolute Maximum Ratings
- VCOREA, VCOREB-0.3V to +1.21V
- VDDIO-0.3V to +1.89V
- VDDIOH-0.3V to +3.6V
- VREGI-0.3V to +3.6V
- VDDA-0.3V to +1.89V
- BLE_LDO_IN-0.3V to 1.5V
- RSTN, GPIO (VDDIOH)-0.3V to VDDIOH + 0.5V
- GPIO (VDDIO)-0.3V to VDDIO + 0.5V
- 32KIN, 32KOUT-0.3V to VDDA + 0.2V
- HFXIN, HFXOUT-0.3V to VDDA + 0.2V
- Output Current (sink) by Any GPIO Pin25mA
- Output Current (source) by Any GPIO Pin-25mA
- VDDIO Combined Pins (sink)100mA
- VDDIOH Combined Pins (sink)100mA
- VSSA100mA
- VSS, VSS_TX, VSS_RX100mA
- VSSPWR100mA
- Continuous Package Power Dissipation CTBGA (multilayer board) TA = +70°C (derate 24.10mW/°C above +70°C)1928.18mW
- Continuous Package Power Dissipation WLP (multilayer board) TA = +70°C (derate 22.33mW/°C above +70°C)1228mW
- Operating Temperature Range-40°C to +105°C
- Storage Temperature Range-65°C to +150°C
- Soldering Temperature+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.