Absolute Maximum Ratings
- IN to GND-0.3V to +65V
- VDD to GND-0.3V to +2.5V
- CPN to GND-0.3V to +65V
- CPP to GND-0.3V to +70V
- CPP to CPN-0.3V to +6V
- CPP to DRx-0.3V to +70V
- DR12 to GND-0.3V to +65V
- DRx to DR(x-1)-0.3V to +16V
- DR6 to GND-0.3V to +65V
- SRCx to GND-0.3V to +65V
- RTEMP, RGRADE, CLKIN, CLKOUT, RADDR to GND-0.3V to VVDD + 0.3V
- RX, TX, FLT to GND -0.3V to +6V
- Continuous Power Dissipation (multilayer board) (TA = 70°C, derate 40.57mW/°C above +70°C)3245.44mW
- Operating Temperature Range-40°C to +125°C
- Junction Temperature+150°C
- Storage Temperature Range-40°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.