Absolute Maximum Ratings- IN, INN, INP, ISP, ISN, GTP1, GTP2 to PGND-0.3V to +65V
- ISP to ISN-0.3V to +0.6V
- ISP to GTP_-0.3V to +6.0V
- LX1, LX2 to PGND-1.0V to +65V
- BST_ to LX_-0.3V to +6V
- DH_ to LX_-0.3V to VBST + 0.3V
- DL1, DL2 to PGND-0.3V to (VCC + 0.3) V
- CSP, CSN to SGND-2.5V to +6V
- CSP to CSN-0.5V to +0.5V
- COMP1, COMP2, to SGND-0.3V to VCC + 0.3V
- VCC to SGND-0.3V to +6V
- ICTRL, EN1, EN2, SHUNT, FB, FLT to SGND-0.3V to +6V
- PGND to SGND-0.3V to +0.3V
- VCC Short-Circuit DurationContinuous
- Continuous Power Dissipation (TSSOP) (TA = +70°C, derate 29.76mW/°C above +70°C)2381mW
- Operating Junction-Temperature Range (Note 1, 2) -40°C to +150°C
- Storage-Temperature Range-40°C to +150°C
- Soldering Temperature (Reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.