The MAX25432 is a single-chip USB PD charging and protection solution with PPS for multimedia hub, rear-seat entertainment module, and head-unit applications. Combined with either a microcontroller or a USB PD controller it is a two-chip solution for dedicated charging module applications. The MAX25432 provides all the functionality for USB PD car battery to VBUS regulation, configuration channel communication, and USB 2.0 Hi-Speed protection. It can optionally provide BC1.2 host charge emulation. The device integrates all of the protection needed in an automotive application for a USB PD application.
The MAX25432 offers the design engineer two options for firmware development. The MAX25432B can operate with a system-on-chip (SoC), USB hub IC, or microcontroller, whereas the MAX25432A is designed to operate with a USB PD controller. The MAX25432 evaluation (EV) kit offers a platform where the design engineer can begin early firmware development.
Recent advancements in the automotive infotainment market demand high-efficiency and low footprint power delivery solutions. The push for lower BOM cost has driven USB power applications to integrate more features and responsibilities into a single IC. The proliferation of USB PD-based battery-powered portable devices has resulted in an increase in the number of USB ports in an automobile to charge the passenger's devices. These multiport charging modules can unnecessarily increase per-port cost when a dedicated MCU with firmware is used for each port. The MAX25432B minimizes per-port cost by using a single microcontroller as a USB Type-C policy manager (TCPM) that is operating as a master, and multiple USB Type-C port controllers (TCPCs) operating as slaves. The TCPM and TCPC communicate with each other using I2C.
The MAX25432B is an advanced automotive integrated USB PD solution that combines the TCPC along with other USB features such as Type-C, PD with PPS, BC1.2, Apple, and Samsung® charging port emulator. All MAX25432 devices implement Analog Devices' proprietary current-mode buck-boost H-bridge controller that can achieve a target USB output voltage with high-efficiency while operating over a wide range of input voltage. The MAX25432 buck-boost controller has robust protection mechanisms such as overvoltage (OV), undervoltage (UV), overcurrent, short-to-ground (STG), short-to-battery, overtemperature, and automotive ESD protections. The MAX25432 implements internal gate drivers to drive external power FETs to accommodate high-power USB requirements. The MAX25432 has an intelligent voltage-adjustment circuit that can adjust the output voltage of the buck-boost converter such that the voltage on the USB receptacle is within specifications regardless of the output current.
All MAX25432 devices have integrated data and CC switches that protect the upstream USB transceiver and/or PD controller from high-voltage events on the cable or the receptacle. All devices also have an integrated VCONN switch to supply power on one of the unused CC pins in different configurations. The high-voltage DP/DM pins (HVDP/HVDM) and CC pins (HVCC1/HVCC2) are monitored and protected for OV conditions such as ESD or short-to-battery/VBUS events. Based on the configuration requested by the TCPM, the MAX25432B has the capability to source different currents on the HVCC pins for a Type-C interface. The MAX25432B also supports biphase mark coding (BMC) communication using integrated USB PD AFE circuits with remote ground offset sensing for long captive cables.
Features
Integrated buck-boost DC-DC controller with drivers for four external MOSFETs in an H-bridge configuration
4.5V to 36V (40V load-dump) input voltage allows operation in “warm-crank” and start/stop conditions
USB PD with PPS
10mV VBUS voltage step size from 3.3V to 21V
25mA VBUS current-limit step size from 1.0A to 6.35A
Four switching frequency options for scalable efficiency, adjustable EMI interference avoidance and power optimization including 220kHz, 300kHz, 400kHz, and 2.2MHz
Forced-PWM at light or no-load conditions for reduced EMI through USB cable
Spread-spectrum option for EMI reduction
SYNC input and SYNC output for frequency parking and multiport applications
Reduced inrush current with soft-start
Thermal shutdown
Integrated USB PD VBUS features
USB PD PPS compliant
Programmable VBUS overcurrent protection limits
Apple MFi R3x compatible
Programmable VBUS undervoltage protection limits
Programmable VBUS overvoltage protection limits
Digital voltage scaling (DVS) for smooth, predictable voltage transitions
Integrated USB VBUS discharge
Integrated output voltage adjustment for cable voltage drop on captive-cable applications
Programmable voltage gain up to 3m/up to 516mΩ cable resistance
1MHz I2C slave Interface with ALERT pin
TCPCI-compliant register set
MAX25432-specific registers for alerts, advanced diagnostics, and management
Maskable alerts for application-specific behavior
Selectable I2C address for multiport applications
Integrated watchdog timer for guaranteed safe operation
MAX25432A devices provide integrated two-input to two-output USB Type-C CC1 and CC2 4Ω (typ) switches for external USB PD controller
MAX25432B devices provide a single-port TCPC-compliant USB PD PHY for an external TCPM
Designed to comply with USB PD, Type-C, and TCPC specifications as a source and DFP
USB Type-C Specification, Revision 1.3
USB Power Delivery Specification, Revision 2.0, and Revision 3.0 Version 1.2
USB Type-C Port Controller Interface Specification, Revision 2.0 Version 1.1
Implements Type-C CC interface and USB PD PHY functions to a TCPM that handles PD policy management
Type-C cable plug orientation detection
Type-C detection supporting default, 1.5A or 3.0A current capabilities
SAR ADC for VBUS (10-bit) and IBUS (7-bit) monitoring
Programmable VBUS voltage alarm thresholds
Integrated 1.5W, 400mΩ (typ) VCONN switch with overcurrent protection removes need for dedicated VCONN DC-DC and allows use of the common-voltage rail in the application
3.0V to 5.5V input voltage support
Programmable ILIM in 50mA steps
Diagnostic current prevents enabling into an STG condition
Fast VCONN input undervoltage protection
Intelligent soft-start and auto-retry for noncompliant VCONN loads
Integrated VCONN discharge on HVCC1 and HVCC2 pins
I2C control saves two GPIOs on the USB PD controller
Whenever "MAX25432" is mentioned in this document, the corresponding description, figure, or diagram applies to all MAX25432 devices.
Whenever "MAX25432A" is mentioned in this document, the corresponding description, figure, or diagram only applies to MAX25432A devices.
Whenever “MAX25432B” is mentioned in this document, the corresponding description, figure, or diagram only applies to MAX25432B devices.
Whenever “G-suffix” is mentioned in this document, the corresponding description, figure, or diagram only applies to MAX25432 devices with the G-suffix. Example: MAX25432BATLG/V+ or MAX25432AATLG/V+ are G-suffix devices.
Whenever “M-suffix” is mentioned in this document, the corresponding description, figure or diagram only applies to MAX25432 devices with the M-suffix. Example: MAX25432BATLM/V+ is a M-suffix device.
References
Table 2 shows the reference specifications, their locations, and the common names they are referred to in this document.
Table 2. References
REFERENCE SPECIFICATION
TITLE
LOCATION
The USB PD Specification
Universal Serial Bus Power Delivery Specification
Revision 3.0, Version 1.2
June 21, 2018
When a valid voltage is applied to IN and HVEN is high, the MAX25432 goes through its power-up sequence as described in the Power-Up Sequence functional diagram. The MAX25432 power-up sequence is done when ALERT asserts low after HVEN goes high with VIN > UVLO. The VDD_IO input must be within a valid voltage to perform I2C communication with the MAX25432 and provide a pullup voltage to the ALERT pin.
IN Supply Input
IN is the input supply for the MAX25432 and the external H-bridge buck-boost converter. The MAX25432 can operate with a VIN voltage in the range of 4.5V to 36V and is load-dump tolerant up to 40V. A 1μF ceramic capacitor with appropriate voltage rating should be connected for decoupling from IN to GND. An additional 100nF closer to the IN pin is recommended for improved high-frequency decoupling for internal circuitry.
To prevent large input current from tripping an upstream automotive fuse during high output power at low input voltage, the MAX25432 integrates a programmable input undervoltage lockout. When the input voltage is below the undervoltage lockout threshold, the buck-boost controller is turned off, which prevents high current being drawn at the input. The undervoltage lockout is set by the IN_UV_THRESH[3:0] register. This voltage can be programmed in the range of 4.5V to 8.5V in steps of 0.4V. The default setting for the undervoltage lockout threshold is 4.5V and can be changed on the fly after power-up through I2C. The UVLO threshold includes a blanking time of 150µs (typ), which prevents the device from turning off during input voltage transients.
High-Voltage Enable Input (HVEN)
HVEN is used as the main enable to the device and initiates the MAX25432 start-up and configuration. If HVEN is at a logic-low level, the device enters the Off mode with low quiescent current level on IN. HVEN is compatible with inputs from 3.3V logic up to automotive battery voltages.
BIAS Linear Regulator Output
The device includes an internal 5V linear regulator (BIAS) that provides power to the internal circuit blocks. The IC powers up once the voltage on BIAS crosses the undervoltage-lockout (UVLO) rising threshold and shuts down when BIAS falls below the UVLO falling threshold. Connect a 4.7μF ceramic capacitor from BIAS to GND for proper operation of the linear regulator. See the PCB Layout Guidelines for more information.
External loads, such as an MCU or PD controller, can be connected to BIAS as a power supply as long as:
The total BIAS current, including internal circuitry, is below 80mA. Make sure to account for the internal buck-boost drivers current consumption when the H-bridge is switching. The usable current for external loads varies depending on operating conditions.
The power dissipated by the internal BIAS LDO does not cause the MAX25432 to exceed the maximum continuous power dissipation or junction temperature as specified in the Absolute Maximum Ratings section.
With the proper current budgeting, BIAS can also be used to provide VCONN power. To do so, tie BIAS to the VCONN pin and program the VCONN OCP low threshold to the 50mA setting. Cables and accessories needing 100mW VCONN can be powered with this method. A 1μF ceramic capacitor close to the VCONN pin with a low impedance to ground is required to minimize voltage dips on BIAS.
External BIAS Supply
In certain applications, the 5V BIAS internal regulator can be turned off and an external voltage can be applied to the BIAS pin to provide power to the internal circuit blocks. To power the BIAS pin with an external voltage source, set the EXT_BIAS_SEL bit on register BIAS_CONTROL to 1. The default setting for this bit is 0 in which case the internal LDO is on. Connect an external voltage on BIAS after startup and before setting the EXT_BIAS_SEL bit to 1. The external voltage should be in the range of 4.7V to 5.4V for proper operation of the MAX25432.
Power-On Sequencing with External BIAS
When using an external 5V rail to power BIAS, the EXT_BIAS_SEL bit must be set after turning on the 5V rail. External back-to-back FETs can be used to switch the 5V rail on/off so as to prevent any supply conflict.
VDD_USB Linear Regulator Output
The MAX25432 integrates a 3.3V low-dropout linear regulator. The VDD_USB output is used as a clamping voltage during high-voltage events such as short-to-battery or ESD strikes on HVDP/HVDM pins. The VDD_USB output is also used to power the internal 10-bit ADC on MAX25432 devices. This regulator uses the 5V BIAS regulator as its input. Connect a 1μF ceramic capacitor from VDD_USB to GND for proper operation of the linear regulator. See the PCB Layout Guidelines for more information.
The MAX25432 includes an output undervoltage comparator that sets the read-only VDD_USB_UV status bit when the regulator output goes below VDD_USB_UV = 2.7V (typ). An output overvoltage comparator is also included, which sets the read-only VDD_USB_OV status bit when the regulator output goes above VDD_USB_OV = 4.0V (typ).
The VDD_USB 3.3V LDO cannot be used to power external loads.
VDD_BMC Linear Regulator Output (MAX25432B only)
The MAX25432B integrates a 1.125V (typ) regulated voltage reference required for BMC communication. Connect a 1μF ceramic capacitor from VDD_BMC to GND for proper operation of the linear regulator. See the PCB Layout Guidelines for more information. Connect the pin directly to GND on MAX25432A devices.
VDD_IO Input
The VDD_IO pin must be connected to the external 1.8V, 3.3V, or 5.0V VDD rail used for I2C communication by the I2C master (MCU, HUB, or PD controller). VDD_IO is used as the pullup voltage for the SCL, SDA, and ALERT pins.
I2C communication can begin as soon as the power-up sequence is done (i.e., ALERT asserts low after HVEN goes high with VIN > UVLO) and the VDD_IO input is within a valid voltage.
In an application where neither 1.8V, 3.3V, nor 5.0V external supplies are available, the VDD_IO pin can be tied to VDD_USB or BIAS directly. It is recommended to place a 10nF ceramic capacitor from the VDD_IO pin to GND to provide local decoupling. The VDD_IO input voltage can withstand a maximum voltage of 6V.
VCONN Supply Input
The device requires an external supply on the VCONN input to provide the required power for the VCONN switch. The input voltage range for the VCONN input is 3.0V to 5.5V but, in an application, the input voltage is typically 3.3V or 5.0V. See the VCONN Switch section for more information.
Buck-Boost Controller
The MAX25432 integrates a buck-boost controller and drivers that provide power from the car battery to VBUS. The buck-boost controller operates for input voltage ranges from 4.5V to 36V and is 40V load-dump tolerant. The buck-boost controller can regulate output voltages from 3.3V up to 21.0V and can limit output current from 1.0A up to 6.35A.
Figure 1. Buck-Boost Block Diagram
The integrated buck-boost controller operates in either a buck or boost, depending on the input and output voltages. The buck-boost transitions seamlessly between these modes to maintain a constant output voltage. This seamless four-switch buck-boost transition method ensures that VBUS does not droop during VIN transients and helps achieve excellent efficiency, load regulation, and line regulation. The architecture consists of a peak current-mode control loop that senses the inductor current using an external current-sense resistor on the input side (RCS1). The slope compensation value can be adjusted in steps of 100mV by the SLP[2:0] register from 100mV to 800mV so as to prevent subharmonic oscillations. The switching frequency is also set by writing to the FSW[1:0] register. Four switching frequency options (220kHz, 300kHz, 400kHz, and 2.2MHz) are available in the device. To alleviate EMI problems the IC integrates a programmable spread spectrum on the switching frequency oscillator. The SS_SEL[1:0] register is used to set the desired amount of spread spectrum, which can be programmed to be ±3%, ±6%, and ±9% of the set switching frequency. The output voltage is fed back to the controller using an internal resistor divider on the OUT pin. The buck-boost control-loop is compensated externally using an RC network on the VCOMP pin. An output current-sense resistor (RCS2) between CSP2 and OUT provides protection from runaway currents (VOC2), and excessive negative currents (VOC3). A third current-sense resistor (RCS3) is required between OUT and CSN2 for VBUS ILIM DC regulation used in PPS Current-Limit (CL) mode. RCS3 is also used for USB cable/voltage drop compensation in order to maintain a constant VBUS voltage at the user port across output current variations.
Enabling/Disabling VBUS
Before enabling VBUS, ensure that the I2C master performs the following initial configuration after power-up:
The cable-compensation gain has been selected to offset any PCB trace/connector and/or cable drop. See the Cable Compensation section.
The slope-compensation peak ramp voltage is correctly set per the system requirements. See the Slope Compensation section.
The switching frequency and desired spread-spectrum settings are correctly set per the system requirements. See the Switching Frequency and Spread Spectrum section.
The VBUS undervoltage and overvoltage thresholds and masks are correctly configured for the application. By default, the 12.5% UV/OV thresholds are selected. See the VBUS_THRESH register description.
VBUS needs to be at vSafe0V before being enabled. Make sure the VSAFE0V bit in the EXTENDED_STATUS[7:0] register reads logic '1'.
If a VBUS pre-bias condition exists, the I2C master needs to attempt a force discharge first using MAX25432 integrated force discharge functionality. The MAX25432 issues an I2C error if VBUS is not at vSafe0V prior to being enabled. See the VBUS Discharge and Fault Table (Analog Devices Auto-Shield) sections.
To comply with the USB-IF TCPCI specification, the MAX25432 only sources VBUS when the proper command is received from the I2C master. In order to enable VBUS:
Write 0x77 (SourceVbusDefaultVoltage) to the COMMAND[7:0] register. The MAX25432 then soft-starts to vSafe5V (5.15V, typ).
To set VBUS to non-default voltages (voltages other than vSafe5V), perform the following steps. Note that once VBUS is at vSafe5V, only then can the I2C master request for non-5V outputs.
Select the desired non-default output voltage by writing to the NONDEFAULT_TARGET registers.
Write 0x88 (SourceVbusNonDefault) to the COMMAND[7:0] register. The MAX25432 then transitions to the non-default voltage with a USB PD compliant slew rate.
To change to a different non-default output voltage target, repeat steps 2 and 3. To go back to vSafe5V, perform step 1. Note that the output current limit can be changed while sourcing VBUS.
To disable VBUS, write 0x66 (DisableSourceVbus) to the COMMAND[7:0] register. The MAX25432 will then turn off the buck-boost. To discharge VBUS to vSafe0V, see the VBUS Discharge section.
For more information on specific actions to be performed with the MAX25432 to comply with USB Type-C and USB power delivery, contact Analog Devices.
Soft-Start
The buck-boost output is enabled by the I2C master by writing to the COMMAND register. When enabled, the controller soft-starts by gradually ramping up the output voltage from vSafe0V to vSafe5V (5.15V, typ). This soft-start feature reduces inrush current during startup. Soft-start is guaranteed into compliant USB loads. Only after the voltage reaches vSafe5V can the buck-boost output voltage be adjusted to other voltage options by the I2C master. The typical soft-start time is 6.5ms.
Switching Frequency and Spread Spectrum
The MAX25432 provides a programmable switching frequency and spread spectrum through I2C. The internal oscillator frequency is set by the FSW[1:0] register. The switching frequency can be programmed to 220kHz, 300kHz, 400kHz, or 2.2MHz.
Spread spectrum can be enabled and adjusted by writing to the SS_SEL[1:0] register. Spread spectrum can be programmed to ±3%, ±6%, and ±9% centered on fSW. The default oscillator frequency at power-up is 400kHz with no spread spectrum.
Table 3 shows the typical variation of the switching frequency for each spread-spectrum setting.
Table 3. Spread-Spectrum Settings vs. Switching Frequency
fSW (kHz)
SPREAD-SPECTRUM MODULATION FREQUENCY (kHz)
±3% SETTING
±6% SETTING
±9% SETTING
220
±6.6
±13.2
±19.8
300
±9
±18
±27
400
±12
±24
±36
2200
±66
±132
±198
Synchronization Input/Output (SYNC)
The MAX25432 integrates a clock synchronization input/output to be used in two-port applications or with other power supplies in the module. The benefits of the synchronization between two switching power supplies are as follows:
Reduced input capacitance requirement due to 180° out-of-phase current demands, which leaves time for the input capacitors to recharge between each cycle.
Reduced EMI due to less input current ripple. This translates to a smaller inductor required for the module input EMI filter.
Both the reduced input capacitance requirement and reduced input current ripple help reduce system cost significantly.
The SYNC pin direction can be configured through I2C as either an input or an output through the SYNC_DIR register. SYNC_DIR is a one-bit register which is set by default to logic '1'. In this case, the SYNC pin on the MAX25432 is expecting an external input signal to synchronize its oscillator to the input on the SYNC pin. If there is no input on this pin, the buck-boost operates with the internal oscillator. Connect SYNC to GND and configure it as an input if not used.
The SYNC_DIR bit can be set to logic '0' by the I2C master. In this case, the SYNC pin acts as an output and, when sourcing VBUS, generates a fixed 50% duty cycle square waveform at the master's switching frequency that is phase shifted by 180°, as shown in Figure 2. Note that only buck operation is shown. The SYNC feature also supports boost and buck/boost operation.
The internal spread spectrum is disabled if SYNC is configured as an input and synchronized to an external clock.
When configured as an output, the SYNC signal includes the spread-spectrum modulation for the slave to synchronize to.
When configured as an input, the external clock signal must be within fSYNC_RANGE of the programmed switching frequency fSW and have a duty cycle between 30% to 70% for the MAX25432 to synchronize properly. If not, the slave reverts to its internal clock synchronization autonomously without changing the SYNC_DIR bit.
Figure 2. SYNC Operation Diagram
Input Current Limit
The MAX25432 features a peak input current limit. The device limits the input current by reducing the output voltage if the sensed voltage drop across the input current-sense resistor (VCSP1 - VCSN1) is above the fixed VOC1 threshold (50mV, typ). The current threshold can be selected with the input current-sense resistor value RCS1. See the Current-Sense Resistors Selection section.
An input overcurrent event sets the latched, read-only IN_OC status bit to logic '1' after a debounce of 16ms.
The MAX25432 reports the event to the VNDR_ALRT bit in the ALERT_H register if the IN_OC_MASK is unmasked. Additionally, if MSK_VNDR_ALRT bit is unmasked, the ALERT pin is asserted low.
VBUS Current-Limit (CL) Regulation
The MAX25432 features a programmable DC current-regulation loop on VBUS to support PPS CL operation.
The buck-boost is allowed to enter the CL mode only when the CL_EN bit is set to 1, as seen in Figure 3.
Figure 3. CL_EN Diagram
When CL_EN = 1 and the VBUS DC output current monitored on RCS3 is less than the programmed current-limit threshold set in the VBUS_ILIM_SET[7:0] register, the buck-boost stays in Constant-Voltage (CV) mode and VBUS is regulated to the programmed voltage target (default or non-default VBUS).
When the VBUS DC output current is above the current-limit threshold, the ICOMP voltage increases and drives the internal feedback node higher to reduce VBUS and maintain constant current. As the PD device increases its load, VBUS reduces further and the MAX25432 maintains accurate regulation until the PD device reduces its load or the sensed OUT voltage reaches the VBUS STG threshold (2.85V, typ), which will turn off the buck-boost. See the Fault Table (Analog Devices Auto-Shield) for more information on the VBUS STG fault.
The buck-boost regulation mode is indicated by the OMF_TRANS and the CL_CV bits in the VENDOR_STATUS and AUTO_SHIELD_STATUS_1 registers, respectively. See the register descriptions in the Register Map for more details.
When CL_EN = 0, the MAX25432 is prevented from entering CL mode. The MAX25432 does not regulate the output current in this mode and maintains CV regulation for the debounce duration. If the current exceeds the programmed threshold in the VBUS_ILIM_SET[7:0] register for more than 16ms (typ), the MAX25432 turns off the buck-boost controller to protect itself and the sink. This setting is recommended when sourcing vSafe5V or fixed PDOs, and also to meet the MFi Overcurrent specification (introduced in the R30 revision in 2018).
Additionally, a fixed overcurrent protection (VBUS OCP), independent of CL_EN setting, is always active when sourcing VBUS. The fault is triggered when VBUS current exceeds 6.4A DC (typ) which immediately causes the buck-boost controller to turn off.
The buck-boost output is protected against an STG condition. An STG event is detected when OUT goes below 2.85V (typ) for CL_EN = 1 or below 2.0V (typ) for CL_EN = 0 while VBUS is being sourced. In this case, the buck-boost controller is turned off immediately. See Fault Action A in the Fault Types table.
Integrated VOUT Pulldown
While the buck-boost is disabled, an active pulldown of 16kΩ (typ) is switched on to keep VBUS at vSafe0V.
Cable Compensation
USB charging current of devices could be as high as 5A while connectors and cables contribute to voltage drops. Stringent USB port supply voltage specifications increase the need for compensation, and excessive voltage drop causes device disconnects. The voltage drop compensation is implemented by measuring the current and feeding back the current information to the internal feedback block of the converter. In this implementation, the load regulation of the power supply is effectively changed to compensate a voltage drop on a power line.
Figure 4. Cable Compensation Benefit
The MAX25432 compensates voltage drops for up to 516mΩ from parasitic resistance present from the OUT pin to the user cable, including but not limited to the USB captive cable, PCB trace, and inline connectors. The cable compensation is designed for use in the constant voltage region at up to 5A. Cable compensation stays active upon entry into current-limit region. The gain of the cable-compensation circuit can be adjusted through I2C by changing the values in GAIN[5:0] in the cable-compensation control register CABLE_COMP_CONTROL. The RCS3 external current-sense resistor is required when using the cable-compensation feature. See the USB Cable Compensation section for guidelines.
Thermal Shutdown
Thermal shutdown protection limits the temperature the device is allowed to reach before forced shutdown. If the die temperature exceeds +165°C, the device shuts down and needs to cool down. Once the device has cooled down by 15°C, the device is automatically enabled again (as long as HVEN is still high and VIN is above UVLO). The thermal overload protects the device in the event of overheating. For continuous operation, do not exceed the absolute maximum junction temperature of +150°C. For more information regarding actions and recovery steps taken upon a thermal shutdown fault, see the Fault Table (Analog Devices Auto-Shield) and Fault Types sections.
USB Type-C and Power Delivery
Figure 5. USB Type-C Functional Block Diagram
A detailed breakdown of the block diagram and operation is provided in the following sections.
Configuration Channel (CC1 and CC2)
To maintain the USB host/device relationship, Type-C requires a configuration channel (CC). It is through the CC pins that current capabilities are advertised and detected, as well as how the host detects the cable orientation, which is required for USB3 and active cables. In the USB Type-C solution, two pins on the connector, CC1 and CC2, are used to establish and manage the source-to-sink connection.
Functionally, the CC is used to serve the following purposes.
Detect attachment of USB ports (e.g., a source to a sink)
Resolve cable orientation and twist connections to establish USB data bus routing
Establish data roles between two attached ports
Discover and configure VBUS: USB Type-C current modes or USB PD
Configure VCONN
Discover and configure optional Alternate and Accessory modes
The CC pins utilize combinations of pullups and pulldowns to detect Type-C device attachment, advertise the current capabilities of the source, and detect the type and orientation of the cable and the device. There are three possible pullups (Rp) which represent the three source current capabilities: default, 1.5A, and 3A. Additionally, there are two possible device pulldown resistors (Ra and Rd) to provide device and cable information to the host. This configuration allows for simultaneous advertisement and detection. The Type-C specification also allows for dynamic Rp changes without any resets.
CC Pass-Through Switches
The Type-C block includes the CC-to-HVCC pass-through switches that provide a protected communication path between the USB PD controller and handheld device. See the CC Pass-Through Switches section for more information.
VCONN
While there are two HVCC pins that must be monitored on the host receptacle, there is only one CC wire running through the Type-C cable. This is how orientation can be determined. This leaves the second HVCC pin available for other uses. The Type-C specification allows the unused HVCC pin to operate as VCONN, a low-power source intended to power active cables which may include authentication ICs or super-speed muxes.
The MAX25432 includes complete support for VCONN power control and protection. When a power source within the acceptable operating voltage is connected to the VCONN pin, the MAX25432 can connect the voltage source to the appropriate HVCC pin. Back-to-back VCONN FETs provide overvoltage and overcurrent protection to the VCONN source in addition to controlling the application of VCONN per the Type-C specification.
The advantage of the MAX25432 is the ability to provide VCONN power from a low-power system supply to a wide-range of E-marked cables (i.e., using the same supply used to power the USB PD controller or MCU), essentially reducing the current budget needed for supplying VCONN and hence reducing the cost and solution size.
However, certain VCONN loads draw currents that exceed the Type-C specification of 1W (max), shortly after VCONN is sourced. This causes unwanted inrush currents and droops on the system supply, ultimately causing a module reset.
To overcome this limitation while being able to provide in the range of 100mW to 1W VCONN power, the MAX25432 implements a dual-threshold overcurrent protection (OCP) with specific debounce timers and a fast UV comparator on the VCONN pin. The first overcurrent threshold (OCP low) is programmable from 50mA to 500mA (typ) with a debounce of 400μs, which allows exceeding the 1W limit momentarily and during startup of the VCONN load circuitry. The second OCP threshold (OCP high) threshold is fixed and set to 750mA (typ) and has a debounce of 5μs, which protects the system supply from noncompliant VCONN loads and/or short circuits. STG diagnostic circuitry is also implemented in order to detect if a STG condition is present before closing the VCONN switch and avoid collapsing the upstream supply.
Enabling VCONN
Program the VCONN OCP low setting by writing to the VCONN_OCPL_SEL[3:0] register. To power 100mW, 5A E-marked cables, the 50mA setting is recommended. Adjust the OCPL threshold based on desired VCONN power supported.
Program the VCONN UV setting by writing to the VCONN_IN_UV_THRESH bit. UV settings of 4.65V and 3.05V are recommended for 5V supply and 3.3V, respectively. The default value at power-up is 3.05V.
Make sure the VCONN supply is enabled and above the VCONN UV-programmed threshold. Read the VCONN_IN_UV status bit to verify.
Unmask Fault and Status bits as desired.
Select the HVCC channel where VCONN is needed by setting the cable polarity bit PLUG_ORNT in the TCPC_CONTROL register.
Set the EN_VCONN bit to logic '1' to enable VCONN.
If VCONN has successfully started up, the MAX25432 sets the POWER_STATUS.VCONN_PRESENT bit to indicate VCONN is being sourced. On the MAX25432B, the corresponding HVCC comparator (found in HVCC_STATUS register) will go from "Ra" to "Open".
Monitor the OCP and UV fault flags.
To disable VCONN, set EN_VCONN to logic '0'.
VCONN Startup
Once the VCONN input is within its operating range and after VCONN is enabled on a HVCC channel, the diagnostic current is enabled on the corresponding channel and the STG comparator is active and monitoring HVCC. If HVCC is above the STG threshold (0.5V, typ), the VCONN switch is soft-started and the diagnostic current turned off after 500μs. The MAX25432 indicates that VCONN has soft-started successfully by setting POWER_STATUS.VCONN_PRESENT to logic '1'.
After VCONN is enabled on a HVCC channel, the IC monitors for additional faults related to VCONN operation.
VCONN Short-to-Ground Detection (STG Detection)
Every time VCONN starts or restarts, the MAX25432 checks for an STG condition. An actual hot STG condition usually trips the VCONN UV fault or VCONN OCP high first. If an STG condition is maintained, the VCONN switch does not soft-start.
When a VCONN STG condition is detected, a 30mA diagnostic current (typ) is enabled for 8ms (typ). If HVCC rises above the STG threshold during the 8ms, the VCONN switch is soft-started normally. If the HVCC voltage does not go above the STG threshold by the end of the 8ms, the MAX25432 disables the diagnostic current source, then waits for 16ms before re-enabling it again and repeating the cycle until either the STG condition is removed or VCONN is disabled through I2C. The STG retry time is fixed at 16ms and cannot be changed.
VCONN Reverse Overvoltage (Reverse OV)
On the first VCONN reverse-OV fault, the VCONN switch is immediately turned off, the diagnostic current is enabled on the corresponding channel and the STG comparator is active and monitoring HVCC.
The MAX25432 reports the fault by setting the VCONN_REV_OV status bit on the first fault and as long as the fault condition is present. Once the fault clears, the VCONN switch attempts to restart autonomously after the time set in the RETRY_TMR register, as long as the VCONN _EN bit is still set to logic '1'.
VCONN Autoretry
Due to the fact that the VCONN supply is a shared supply, asynchronous system loads can happen while sourcing VCONN. For this reason, a VCONN autoretry feature is implemented to minimize the software interaction when sourcing VCONN with a shared supply.
If a VCONN load tries to draw an excessive amount of current for more than the debounce time, the VCONN switch automatically opens to avoid drooping the upstream power supply, then will retry automatically. After three consecutive faults, the ALERT pin asserts indicating the I2C master to take action if needed.
The autoretry feature is only active for the VCONN OCP and VCONN UV faults.
VCONN Overcurrent Protection (OCP Low/High)
On the first VCONN OCP fault and after the debounce time, the VCONN switch is immediately turned off, the diagnostic current is enabled on the corresponding channel and the STG comparator is active and monitoring HVCC.
If another OCP fault is detected, the fault process repeats again. After three consecutive faults, the VCONN_OCP_FAULT bit is latched and the retry timer starts (default 16ms). Once the timer expires, the SHIELDING bit is set and the process repeats again with the fault counter restarting. Note that only the I2C master can clear the VCONN_OCP_FAULT bit.
Upon the VCONN_OCP_FAULT bit being set, the I2C master can take action to clear the bit, then disable VCONN. The I2C master can proceed without powering the noncompliant E-marked cable until a new cable is detected.
To disable the OCP fault detection, set the VCONN_OCP_DET_EN bit to 1 in the FAULT_CONTROL register.
VCONN Undervoltage (UV)
On the first UV fault, the VCONN switch is immediately turned off, the diagnostic current is enabled on the corresponding channel and the STG comparator is active and monitoring HVCC. If the fault is no longer present, the VCONN switch soft-starts normally as described in VCONN Startup in the USB Type-C and Power Delivery section.
However, if another UV fault is detected, the fault autoretry is engaged and the fault process repeats again. After three consecutive faults, the VCONN_IN_UV status bit is set and the retry timer will start (default 16ms). Once the timer expires, the process repeats again with the autoretry fault counter restarting at 0.
The MAX25432 reports the fault by setting the VCONN_IN_UV status bit on the third fault and as long as the fault condition is present.
To disable the VCONN UV fault reporting, set the VCONN_OCP_DET_EN bit to 1 in the FAULT_CONTROL register. Note the VCONN UV fault actions and recovery will still be active in this case; only the reporting will be disabled.
VCONN Automatic Discharge
To comply with the Type-C specification, the corresponding HVCC pin is discharged for 1ms every time VCONN is disabled. The internal discharge circuit consists of a 2.65kΩ resistance and a low-side FET.
Legacy Devices
The Type-C specification ensures interoperability with Type-A/Type-B devices by defining requirements for legacy adapters. As a DFP, relevant adapters connect from the Type-C receptacle to either a Type-B plug or to a Type-A receptacle, which can then be used with any legacy Type-A cable. A compliant legacy adapter of this type must include an Rd termination inside the adapter. In this case, the MAX25432 detects a Type-C attachment whenever the adapter is connected, regardless of whether a portable device is connected. The portable device sees the DFP as a BC1.2 port (when configured as such). See the Host Charge Emulation section for additional information.
Port Controller and Power Delivery
Type-C Port Controller Interface (TCPCI) (MAX25432B only)
The MAX25432B devices implement a TCPCI as defined in the USB Type-C Port Controller Interface Rev. 2.0 Ver. 1.1.
TCPCI is the interface between a USB Type-C port manager (TCPM) and a USB Type-C port controller (TCPC).
The goal of the TCPCI is to provide a defined interface between a TCPC and a TCPM to standardize and simplify USB Type-C port manager implementations.
The TCPC is a functional block which encapsulates VBUS and VCONN power controls, USB Type-C CC logic, the USB PD BMC physical layer and protocol layer other than the message creation.
Contact Analog Devices for more information on how to program the TCPM to work with the MAX25432B.
BMC Transmitter (MAX25432B only)
The MAX25432B supports USB PD message transmission and reception (Tx/Rx) through the bi-phase mark coding (BMC) interface on the HVCC channels. The BMC communication is used by the source and sink to exchange USB PD messages. The BMC communication is single ended and occurs between two port partners (a source and a sink) after a Type-C attachment has been successfully made. The CC line that is going through the USB cable is used by the two port partners to communicate using BMC.
The BMC transmitter driver overdrives the DC bias voltage on the HVCC pin that is set for device attachment while transmitting. The BMC transmitter driver returns to a Hi-Z state when not transmitting.
Note: The MAX25432B meets the BMC eye diagram specifications as defined in the USB Power Delivery Specification. The MAX25432B's BMC driver is referenced to the SHLD_SNS pin and therefore BMC communication is not affected by the IR drop caused by the external shield short-to-battery FET, if used. A Type-C captive cable with dedicated ground sense allows compensation for ground offset during charging as pictured in Figure 6.
For more information on the BMC Protocol and Signaling, refer to the USB Power Delivery Specification Revision 3.0, Version 1.2.
Figure 6. USB PD PHY Ground Offset Compensation
Sink Tx Ok (MAX25432B only)
When a PD contract is established, the sink shall ignore Rp current advertisement as USB PD takes precedence over Type-C.
After a PD contract, the TCPM can change the Rp advertisement of the TCPC to signal Sink Tx Ok. Rp advertisement is therefore used as a low-level signaling feature. This feature was added in USB PD Revision 3.0.
VBUS Voltage and Current ADC
Figure 7 shows the block diagram of the VBUS voltage and current ADC. The MAX25432 integrates signal conditioning, multiplexing, conversion, and result registers. The conversion results are used to trigger interrupts using the VBUS voltage alarms registers or can be read by the TCPM for periodic monitoring.
Figure 7. VBUS ADC Block Diagram
All MAX25432 devices integrate a VBUS voltage and current continuous-sampling SAR ADC with a resolution of 10 bits for voltage and 7 bits for current.
The ADC sampling is disabled at POR. To enable sampling, write logic '0' to bit D6 (VBUS_VOLT_MON_EN) of the POWER_CONTROL register 0x1C. To stop ADC sampling, write logic '1' to bit D6 of the POWER_CONTROL register 0x1C.
The voltage conversion result after each sample is stored in registers VBUS_VOLTAGE_L and VBUS_VOLTAGE_H and can be accessed through an I2C Read transaction. The MAX25432 maintains synchronization of the 10-bit result between the VBUS_VOLTAGE_L and VBUS_VOLTAGE_H registers by latching the VBUS_VOLTAGE_H value at the time of the VBUS_VOLTAGE_L is read. Therefore, an I2C Read Word transaction starting at VBUS_VOLTAGE_L address is recommended. See the I2C Interface section for more information on the Read Word transaction.
The current conversion result after each sample is stored in the VBUS_CURRENT register and can be accessed through an I2C Read Byte transaction.
The VBUS_VOLTAGE_L, VBUS_VOLTAGE_H, and VBUS_CURRENT registers are shown in Figure 9.
Figure 9. Voltage and Current Registers for ADC Result
A 10-bit value for the voltage conversion result is obtained by combining bits D[1:0] of the VBUS_VOLTAGE_H register with bits D[7:0] of the VBUS_VOLTAGE_L register.
V_ADC_Result = (UInt16)((VBUS_VOLTAGE_H & 0x03) x 256) + VBUS_VOLTAGE_L)
To convert the ADC_Result to the measured VBUS voltage, multiply it by 25mV.
To convert the VBUS_CURRENT[7:0] result to the measured VBUS current, multiply its decimal value by 50mA. Note that the VBUS_CURRENT[7] bit always equals 0b (7-bit effective on a 8-bit register).
Note that since voltage and current are measured one after the other, new conversion results in VBUS_VOLTAGE[9:0] and VBUS_CURRENT[7:0] registers are 1ms apart (typ).
The ALERT pin will not assert when a new conversion result is ready. The I2C master must use polling to read the most recent conversion results.
See the register descriptions in the Register Map for more information on the ADC.
VBUS Alarms (MAX25432B only)
The 10-bit ADC conversion results are compared with the alarms thresholds set by the TCPM. Those alarms can be used to alert the TCPM during USB PD VBUS voltage transitions or in CL mode. To enable VBUS alarms, write a logic '0' to VOLT_ALRMS_EN bit in the POWER_CONTROL register. The VBUS ADC must be enabled for the alarms to operate.
The MAX25432B VBUS alarms are compliant with the USB PD specification. Contact Analog Devices for more information on how to program the VBUS alarms.
vSafe0V Comparator
To comply with the Type-C specification, the MAX25432 implements a vSafe0V comparator to indicate when VBUS (sensed on the OUT pin) is below the vSafe0V threshold. Unlike the VBUS discharge stop threshold, the vSafe0V threshold is fixed to 0.75V falling with a 50mV hysteresis (typ).
The I2C master can check the status of the vSafe0V comparator by reading the VSAFE0V bit in the EXTENDED_STATUS[7:0] register located in the TCPCI-compliant register section.
A logic '1' of this bit signifies VBUS is at or below vSafe0V threshold. A logic '0' signifies VBUS is above the vSafe0V threshold. This status bit is read-only and non-latched.
Whenever the VSAFE0V bit changes and the MSK_VSAFE0V is set to '1' (unmasked), the EXTENDED_STATUS alert bit is set.
The vSafe0V status is valid only when the VBUS Detection Enabled bit (VBUS_DET_EN) located in the POWER_STATUS[7:0] register becomes a '1'. The VBUS_DET_EN bit is read-only and indicates the MAX25432 is monitoring for VBUS present and vSafe0V thresholds.
VBUS Present Comparator
In order to enable the VBUS present comparator, the TCPM must send the EnableVbusDetect command (0x33) to the COMMAND register.
Whenever the VBUS_DET_EN read-only bit becomes logic '1', the VBUS present comparator is active and monitoring the OUT pin. If the voltage sensed on OUT goes above 4V (typ), the MAX25432 sets the VBUS_PRESENT bit in the POWER_STATUS register to alert the TCPM that VBUS is present on the Type-C connector.
To disable the comparator, the TCPM must send the DisableVbusDetect command (0x22). Note that the EnableVbusDetect and DisableVbusDetect commands also enable and disable the vSafe0V comparator, respectively.
VBUS Overvoltage/Undervoltage (OV/UV) Comparator
Programmable VBUS OV and UV comparators are implemented in the MAX25432.
To program the VBUS OV and UV thresholds, write to VBUS_OV_THRESH[2:0] and VBUS_UV_THRESH[2:0], respectively, located in the VBUS_THRESH[7:0] register. The thresholds are set to +12.5% and -12.5% of the current VBUS target set by the VOUT_SEL[1:0] register.
Upon an overvoltage event on VBUS, the MAX25432 will turn off VBUS and discharge it to vSafe0V immediately (Fault Action A). See the Fault Detection and Diagnostics section for more information on this fault.
The MAX25432 will report an overvoltage event through the VBUS_OVP_FAULT in FAULT_STATUS register if the VBUS_OVP_DET_EN in the FAULT_CONTROL register is set to logic '1'. If the MSK_VBUS_OVP bit in FAULT_STATUS_MASK register is unmasked, the FAULT_STAT bit in the ALERT_H register will be set and latched to logic '1'. The ALERT pin will be asserted low if the MSK_FAULT_STAT bit is unmasked. Write a '1' to FAULT_STAT and VBUS_OVP_FAULT to clear the fault.
The MAX25432 will report an undervoltage event through the VBUS_UV status bit in the AUTO_SHIELD_STATUS register. If the VBUS_UV_MASK bit in the AUTO_SHIELD_STATUS_MASK register is unmasked, the VNDR_ALRT bit will be set and latched to logic '1'. The ALERT pin will be asserted low if the MSK_FAULT_STAT bit is unmasked. Write a '1' to VNDR_ALRT to clear the fault.
When VBUS is disabled, the residual charge stored in the buck-boost output capacitance must be removed to comply with the Type-C specification. The MAX25432 has an internal discharge path that when activated, discharges VBUS to a set threshold. Figure 10 shows the discharge internal circuitry used for both force and auto-discharge features, which are compliant with the USB PD and TCPCI specifications.
Figure 10. VBUS Discharge Block Diagram
VBUS Force Discharge
Whenever the FORC_DISCH_EN bit D2 in the POWER_CONTROL register is set from logic '0' to '1', the 125Ω discharge RDIS is switched on and the discharge monitoring starts. The MAX25432 automatically disables the force discharge circuit (without clearing FORC_DISCH_EN bit) once the voltage on VOUT has reached the value indicated by the 10-bit VBUS_STOP_DISCH_THRESHOLD register. It is recommended to use the minimum stop threshold of 0.5V to pass compliance.
If VOUT does not reach the programmed Stop threshold (default 0.8V) within 650ms, the discharge stops to avoid possible overheating and flags the FORCE_DISCH_FAIL bit, which, if unmasked, sets the FAULT_STAT bit in the ALERT_H register. If FAULT_STAT is unmasked, ALERT is asserted. A typical use case of the VBUS force discharge is after a device disconnect when using a PD controller with the MAX25432A or a hard reset when using either the MAX25432A or MAX25432B.
See the Register Map for more information on the VBUS force discharge function.
VBUS Auto-Discharge
The VBUS auto-discharge function (MAX25432B devices only) is enabled by setting the AUTO_DISCH_DISC_EN bit D4 to 1 after a device attachment. When the MAX25432 detects a device disconnect, sourcing VBUS is disabled, then the 125Ω discharge resistor RDIS is switched on automatically and discharge monitoring starts. The MAX25432 automatically disables the auto-discharge circuit (without clearing AUTO_DISCH_EN bit) once the voltage on VOUT has reached the value indicated by the 10-bit VBUS_STOP_DISCH_THRESHOLD register. It is recommended to use the minimum stop threshold of 0.5V to pass compliance.
If VOUT does not reach the programmed stop threshold within 650ms, the discharge stops to avoid possible overheating and flags the AUTO_DISCH_FAIL bit, which, if unmasked, sets the FAULT_STAT bit in the ALERT_H register. If FAULT_STAT is unmasked, ALERT is asserted.
See the Register Map for more information on the VBUS auto-discharge function.
Figure 11 shows the POWER_CONTROL register which contains the VBUS auto and force discharge enable bits.
Figure 11. POWER_CONTROL Register for VBUS Discharge
Figure 12 shows a typical VBUS discharge waveform. The blue curve shows a VBUS discharge reaching the programmed stop threshold before the 650ms timeout and is therefore successful and no error flag is set. The red curve shows a discharge that did not reach the stop threshold on time and therefore is flagged as fail on either the FORCE_DISCH_FAIL or AUTO_DISCH_FAIL depending on the type of discharge used.
Figure 12. VBUS Discharge Timing Diagram
Note: tSAFE0V maximum value is defined in the USB PD specification.
Discharge Time
Due to the high-side FET circuit topology, VOUT is discharged at a constant current rate first, down to 3.3V, then at a rate of RDIS.CTOT.
The discharge time tDIS can be estimated using the following equation:
Where:
CTOT: the total output capacitance, in F
VSTART, VSTOP: the start and stop voltages, in V
RDIS: the internal discharge resistance, in Ω. RDIS = 125Ω (typ)
IDIS: the constant current discharge rate when VBUS > 3.3V, in A. IDIS = 28mA ±20%
Example
Table 4 shows typical discharge times for different output voltages.
Table 4. Discharge Times for Different Output Voltages
Note: USB-IF does not allow non-USB charging protocols on a USB Type-C connector. Analog Devices provides these features as optional for the user.
Charge Mode Selection
The MAX25432 integrates the latest USB-IF Battery Charging Specification Revision 1.2 (BC1.2) CDP and DCP circuitry. The Auto-DCP modes provide either 1.0A and 2.4A resistor bias options for Apple-compliant devices. Legacy Samsung Galaxy 1.2V divider and China YD/T1591-2009 compatibility is also provided by the Auto-DCP modes.
Refer to the following Analog Devices Tutorials for more information on BC1.2:
Note: The host charge emulation block, which includes the Auto-CDP and Auto-DCP state machines, is independent of the Type-C interface, VBUS or VCONN status, and vice versa. Certain faults will turn off, then reset the host charge emulation block. See the Fault Table (Analog Devices Auto-Shield) for more information.
Auto-CDP Mode
Figure 14. Auto-CDP State Diagram
This mode allows simultaneous charging through VBUS (up to 1.5A per BC1.2*) and data transfer through the USB data path. In the Auto-CDP mode, the HVDP/HVDM pins are initially used to support primary and secondary detection implemented by the PD prior to switching over to their data roles during the USB session. Note that LS/FS and USB Hi-Speed 2.0 communication is only supported in the USB session state (starting in step 7, ending in step 9).
Within the Auto-CDP mode, the MAX25432 will automatically transition between CDP signaling and the USB session state without software interaction. The principle of operation is described as follows:
The USB data switches (SA switches) are initially open (step 0 in Figure 14), and the detection circuitry is connected to HVDP/HVDM (SB switches). This is the resting state in the Auto-CDP mode and is the called CDP Signaling state. In the CDP Signaling state, 19kΩ (typ) pulldowns are applied on HVDP/HVDM and IDAT_SINK is active on HVDP.
Upon being plugged in, the portable device may perform data contact detection (DCD) to check whether the data pins have made contact. Some portable devices skip this step and instead implement a delay.
Once DCD is done, the portable device will apply 0.6V (typ) on HVDP and look for the same voltage on HVDM (step 1). If it sees the same voltage, it knows the host is either a CDP or a DCP.
Once the MAX25432 sees the 0.6V voltage on HVDP, it will apply 0.6V on HVDM by turning on VDAT_SRC (step 2). This step is called primary detection and is used to differentiate between a charging port and a standard downstream port (SDP). Per the BC1.2 specification, a charging port may support USB data (CDP) or be used only for charging (DCP).
In secondary detection, the MAX25432 turns off the 0.6V source on HVDM (step 3), the portable device turns off the 0.6V source on HVDP (step 4) and applies 0.6V on HVDM (step 5). Since no voltage will appear on HVDP, the portable device knows it is attached to a CDP (step 6). This is the last step of the BC1.2 detection and is used to differentiate between a CDP and a DCP.
Once the CDP detection is done, the MAX25432 will look for the enumeration signal on either HVDP or HVDM (1.6V, typ). Once this signal is detected, the MAX25432 will close the data switches (step 7) to allow the host and device to establish USB Hi-Speed communication (step 8). This state is called USB Session mode and is exited when no data traffic has happened on the bus for 500ms or more (step 9).
* Note that a higher Type-C or USB PD current advertisement takes precedence over BC1.2.
USB On-The-Go, Dual-Role Applications and Field Programmability
The MAX25432 is fully compatible with USB OTG and dual-role applications. A negotiated role swap (HNP or Apple CarPlay) requires no software interaction with the IC. When there is no negotiation before the SoC enters peripheral mode, the MAX25432 must be in Hi-Speed pass-through (SDP mode) before and during the role swap.
The MAX25432 devices default to SDP mode on startup. This configuration allows a role swap immediately upon startup without microcontroller interaction. This also allows the application firmware to be programmable though the USB data lines once the vehicle is in the field.
Note that the I2C master can change the Data Switch mode anytime by writing to the AUTO_CDP_DCP_MODE[1:0] register.
Protection
In an automotive Type-C PD application, several threats to the module can be encountered.
In case of a short-to-VBUS event on CC connector pins, the VCONN switch must protect the upstream supply against overvoltage. The CC switches must clamp and dissipate the energy in order to protect the upstream CC controller from pin damage.
In case of a short to GND, the shared 3.3V or 5.0V rail supplying VCONN shall not brownout or be damaged.
For applications with a USB 2.0 host, the host's DP/DM pins typically have an absolute maximum rating of VDD + 0.3V = 3.6V and therefore will not survive any short-to-battery, short-to-VBUS, or automotive ESD event.
Short-to-battery (18V) can happen during module assembly, repair, or in the field (e.g., the end-user dropping the end of cable in the cigarette lighter).
Short-to-VBUS (21V PD, up to 24V) is very common for USB Type-C ports and can happen upon device removal due to mechanical twisting, debris, or insertion of a non-PD compliant source into the port.
The MAX25432 protects the module against all of these threats.
Figure 15. USB Power Delivery Protection Block Diagram
USB 2.0 Data Switches
The DP and DM pins are the protected side of the USB data switches and connect directly to the low-voltage upstream USB PHY or captive cable. No external circuitry is used on either data pin.
The HVDP and HVDM pins should be routed to the downstream Type-C connector or captive cable. No external circuitry is required on either pin. The HVDP and HVDM pins are tolerant to automotive high ESD and up to 24V transients.
CC Pass-Through Switch
The CC1 and CC2 pins are the protected side of the CC switches and either connect directly to the upstream USB PD controller for MAX25432A devices or internally to the TCPC block for MAX25432B devices. No external circuitry is needed on either CC pin. The HVCC1 and HVCC2 pins connect directly to the downstream USB Type-C port connector or captive cable. No external circuitry is needed on either HVCC pin. HVCC1 and HVCC2 are tolerant to automotive high ESD and up to 24V transients.
Shield Short-to-Battery Protection
A USB shield/GND short-to-battery event can occur when a customer's portable device cable is connected to the downstream receptacle and the far end of this cable falls into the 12V cigarette lighter receptacle and contacts the 12V center terminal. This condition results in a damaging amount of current flow, with insufficient response time by the cigarette lighter fuse. The MAX25432 with G-suffix is designed to sense this shield short-to-battery condition with the SHLD_SNS pin and control an external nFET with the GDRV pin. The normally open (NO) ground logic will ensure no damaging current flows on Type-C to Type-C user cables by keeping the downstream connector ground open when no device is attached.
Figure 17 illustrates the circuit for the shield short-to-battery protection feature. When a Type-C attachment is present and the cable shield makes contact with VBAT, a large surge current flows through the FET’s RDS(ON) to ground. This surge current develops a voltage across it and is sensed through the MAX25432 SHLD_SNS pin. When the sense voltage exceeds a certain voltage threshold or slope, the fault-detection comparator is triggered. After a debounce period, the GDRV pin output goes low, causing the FET to switch off and reports the fault condition to the SHLD_EVENT bit. Once the fault condition is removed, the GDRV pin goes high to turn the FET on. The SHLD_EVENT flag can be cleared by the I2C master.
Principles of Operation
Normally Open Ground (All Devices)
The MAX25432 devices continuously monitor for a Type-C device attach and controls GDRV based on attach/detach events and timer circuitry.
When a Type-C connection is not present, the MAX25432 devices protect against shield short-to-battery events by leaving GDRV low. In this state, the USB shield and all other USB Type-C grounds are floating; however, a weak pulldown from SHLD_SNS is always active. This pulldown enables an Rd attach to be detected, while not providing a low-resistance path to ground.
When a valid Type-C attach is present, GDRV remains high for as long as the connection is present. A valid type-C attach may be to a native USB Type-C device, a Type-C to legacy adapter/cable, or an Apple Lightning cable.
If unused, GDRV should be tied with a 1MΩ resistor to ground.
Fault Detection (G-Suffix only)
The MAX25432 G-suffix will protect against damaging surge currents on any user cable by using two unique detection methods on the SHLD_SNS pin:
Threshold Detection: Surge current exceeds a fixed threshold for several microseconds.
Slope Detection: Surge current exceeds a fixed upper slew-rate limit.
Either of these protection mechanisms can trigger the shield short-to-battery fault handling described in the Fault Table (Analog Devices Auto-Shield). Threshold and slope detections are automatically disabled when any of the following conditions are true:
An attached USB device draws more than 400mA (typ). This condition resets when the current falls below 200mA (typ).
An attached USB device has initiated a BC1.2 handshake (in Auto-CDP or Auto-DCP mode).
A valid PD message was sent when VBUS is being sourced. This condition resets when VBUS is turned off or upon POR.
When a shield short-to-battery event is detected, GDRV is driven low until 1ms after the fault condition has cleared.
GDRV Truth Table
Table 6 shows the state of the GDRV pin with respect to the level detected on HVCC1 and HVCC2. This table applies to all MAX25432 G- and M-suffix devices. For the MAX25432A, it is assumed a PD controller is present upstream.
Table 6. GDRV Truth Table
VIN > UVLO
HVEN
SOURCING
VBUS OR VCONN
HVCC1
HVCC2
GDRV
No
X1
X
X
X
Low
Yes
Low
X
X
X
High
No
Open
Open
Open
Ra
Ra
Open
Open
Rd
High2, 3
Rd
Open
Rd
Ra
Ra
Rd
Ra
Ra
Rd
Rd
Yes
X
X
Note 1: "X" = Don't Care.
Note 2: G-suffix devices: If no shield short-to-battery fault has been detected.
Note 3: Minimum GDRV on-time is 32ms (typ).
Fault Detection and Diagnostics
The MAX25432 features advanced fault reporting and management mechanisms to protect the system from various events that are not within normal operating conditions. The MAX25432 is designed to eliminate false fault reporting by using internal deglitch and fault blanking timers. This ensures the SHIELDING bit is not incorrectly asserted during normal operation, such as starting into heavy capacitive loads. To report the fault to the ALERT pin, set the corresponding mask bit. Table 7 describes the different faults, reporting mechanisms, debounce values, action, and recovery type. Each action and recovery type is defined in Table 8.
Table 7. Fault Table (Analog Devices Auto-Shield)
NAME
EVENT
REPORTING
DEBOUNCE PRIOR TO ACTION
FAULT ACTION
FAULT RECOVERY
Thermal Shutdown
IC temperature exceeds the Thermal Shutdown Temperature
TSHDN
SHIELDING
VNDR_ALRTa
100μs
A
A
HVCC OV
HVCC1 or HVCC2 exceeds the VOV_HVCC threshold
HVCC_OV
SHIELDING
VNDR_ALRTa
Immediate
A
A
HVD OV
HVDP or HVDM exceeds the VOV_D threshold
DATA_OV
SHIELDING
VNDR_ALRTa
Immediate
A
A
VDD_USB OV
VDD_USB exceeds the VDD_USB_OV threshold
VDD_USB_OV
SHIELDING
VNDR_ALRTa
Immediate
A
A
VDD_USB UV
VDD_USB falls below the VDD_USB_UV threshold
VDD_USB_UV
SHIELDING
VNDR_ALRTa
Immediate
C
C
VBUS ILIM
CL_EN = 0: VBUS current exceeds the threshold set in the VBUS_ILIM_SET registers
CV_ILIM
SHIELDING
VNDR_ALRTa
16ms
A
A
CL_EN = 1: VBUS current exceeds the threshold set in the VBUS_ILIM_SET registers.
Enters current-limit (CL) regulation. Not a fault.
CL_CV
OMF_TRANSc
VNDR_ALRTa
N/A
None
N/A
VBUS OCP
CL_EN = 0: VBUS current exceeds the IOUT_OCP threshold(e).
VBUS_OCP_FAULT
FAULT_STATb
50μs
A
A
CL_EN = 1: VBUS current exceeds the IOUT_OCP threshold(e).
250μs
VBUS OV
CL_EN = 0: VOUT exceeds the threshold set in the VBUS_OV_THRESH[2:0] register(f), except when VBUS is off, soft-starting or during VBUS transitions
VBUS_OVP_FAULT
FAULT_STATb
Immediate
A
A
CL_EN = 1: VOUT exceeds the threshold set in the VBUS_OV_THRESH[2:0] register(f), except when VBUS is off or soft-starting
250μs
VBUS UV
CL_EN = 0: VOUT falls below the threshold set in the VBUS_UV_THRESH[2:0] register, except when VBUS is off, soft-starting or during VBUS transitions.
VBUS_UV
SHIELDING
VNDR_ALRTa
16ms
C
C
CL_EN = 1 and CL_CV = 0: VOUT falls below the threshold set in the VBUS_UV_THRESH[2:0] register, except when VBUS is off or soft-starting.
CL_EN = 1 and CL_CV = 1: VOUT falls below the threshold set in the VBUS_UV_THRESH[2:0] register, except when VBUS is off or soft-starting.
None
N/A
None
N/A
VBUS STG
CL_EN = 0: VOUT falls below 2.0V (typ)
VBUS_SHT_GND
SHIELDING
VNDR_ALRTa
Immediate
A
A
CL_EN = 1: VOUT falls below 2.85V (typ)
VBUS Pre-Bias OV
COMMAND. SourceVbusDefaultVoltage is received, but VOUT is above the vSafe0V threshold.
The differential voltage across the input current sense resistor exceeds the VOC1 threshold (16.6A (typ) for RCS1 = 3mΩ)
IN_OC
SHIELDING
VNDR_ALRTf
16ms
C
C
Buck-Boost Output Runaway
VBUS is below 50% of the target regulation voltage or the differential voltage across the output current sense resistor is above the VOC2 threshold (output runaway)
VBUS_RNA
SHIELDING
VNDR_ALRTa
Immediate
A
A
Note a: If SHIELDING_MASK = '1'
Note b: If if the corresponding FAULT_STATUS_MASK[7:0] is set
Note c: If OMF_TRANS_MASK = '1'
Note d: On the third consecutive fault
Note e: If VBUS_OCP_DET_EN = '0'
Note f: If VBUS_OVP_DET_EN = '0'
Note g: If VCONN_OCP_DET_EN = '0'
Table 8. Fault Types
FAULT TYPE
ACTION1
RECOVERY
A
Assert ALERT2
Disable DC-DC, discharge to vSafe0V
Open data switches
Open CC passthrough switches
Discharge HVCC1 and HVCC2 pins
Open VCONN switch for RETRY_TMR setting
Reset BC1.2 state machine
DC-DC can be re-enabled by the I2C master through the COMMAND register
Close data switches
Close CC passthrough switches
Close VCONN switch based on TCPC POWER_CONTROL[0] and TCPC_CONTROL[0] settings
B
First and second fault:
Open VCONN switch
Start VCONN STG detect sequence
Start VCONN retry sequence
Third fault: Same as first two faults except:
Open VCONN switch for the time set in RETRY_TMR bit field
Assert ALERT2
(Note 3)
Close VCONN switch depending on TCPC POWER_CONTROL[0] and TCPC_CONTROL[0] settings
C
Assert ALERT2
None
D
Open VCONN switch for the time set in RETRY_TMR bit field
Assert ALERT2
(Note 3)
Close VCONN switch depending on TCPC POWER_CONTROL[0] and TCPC_CONTROL[0] settings
Note 1: Faults do not reset the TCPC state machine nor disable Rp current sources.
Note 2: If MSK_VNDR_ALRT = 1
Note 3: The MAX25432 always maintains CC switches closed during those faults.
I2C, Control, and Diagnostics
I2C Diagnostics and Events Handling
Contact Analog Devices for more information on how to program I2C diagnostics and events handling.
Mask Registers and Nested Alerts
The registers in this section provide the masks that may be set for the ALERT registers. A masked register still indicates in the ALERT register, but does not set the ALERT pin low. POWER_STATUS_MASK, FAULT_STATUS_MASK, EXTENDED_STATUS_MASK and ALERT_EXTENDED_MASK registers are nested alerts.
A POWER_STATUS change has to be unmasked in both the POWER_STATUS_MASK and the ALERT_MASK_L.MSK_PWR_STAT to assert the ALERT pin.
A FAULT_STATUS change has to be unmasked in both the FAULT_STATUS_MASK and the ALERT_MASK_H.MSK_FAULT_STAT to assert the ALERT pin.
An EXTENDED_STATUS change has to be unmasked in both the EXTENDED_STATUS_MASK and the ALERT_MASK_H.MSK_EXTND_STAT to assert the ALERT pin.
An ALERT_EXTENDED change has to be unmasked in both the ALERT_EXTENDED_MASK and the ALERT_MASK_H.MSK_ALRT_EXTND to assert the ALERT pin.
In the application, the TCPM will first clear all bits in FAULT_STATUS register and then clear FAULT_STAT bit in ALERT_H to clear the ALERT, provided all fault conditions are cleared.
Figure 18 and Figure 19 describe the alerts, and the corresponding masks and links between them. A Level 1 alert requires to have one mask bit unmasked to assert the ALERT pin. A Level 2 alert requires to have two mask bits unmasked to assert the ALERT pin.
Figure 18. Nested Alerts Diagram - ALERT_H
Figure 19. Nested Alerts Diagram - ALERT_L
I2C Interface
The MAX25432 is an I2C slave device and requires an I2C master to communicate with its internal registers. It can accept SCL clock rates up to 1MHz, and its 7-bit device address can be set to 0x50, 0x51, 0x52, or 0x53 through the ADDR input pin.
The master, a PD controller, SoC or microcontroller, generates SCL and always initiates data transfer on the bus. The MAX25432’s SCL line operates as an input only. A pullup resistor greater than 500 Ω is required on SCL if the master has an open-drain SCL output.
The MAX25432’s SDA line operates as both an input and an open-drain output. A pullup resistor greater than 500Ω is required on the SDA line.
These resistors should be placed close to the MAX25432 SCL and SDA pins to minimize the effects of I2C bus capacitance. Analog Devices recommends using a value of 4.7kΩ for both resistors in most cases. Series resistors in line with SCL and SDA are optional. The SCL and SDA inputs suppress noise spikes to assure proper device operation even on a noisy bus.
The MAX25432 I2C slave logic is powered by the voltage applied to VDD_IO (1.8V to 5.0V), allowing the MAX25432’s logic levels to be matched with those of the I2C master. Note that I2C communications is possible even if the buck-boost is not switching (i.e., when VBUS is off).
Figure 20. Typical I2C Application Diagram
Interrupt Output (ALERT Pin)
ALERT is an active-low, open-drain output that asserts to notify the I2C master of an interrupt. A pullup to VDD_IO is required for proper operation. Note that certain bits require their corresponding mask bit to be set for the ALERT pin to be asserted, as the mask bits act as AND gates.
I2C Slave Addressing (ADDR Pin)
Once the device is enabled, the I2C slave address is set and latched based on the ADDR pin. The address is defined as the 7 most significant bits (MSBs) followed by the R/W bit. Set the R/W bit to 1 to configure the devices to Read mode. Set the R/W bit to 0 to configure the device to Write mode. The address is the first byte of information sent to the devices after the START condition.
Table 9. I2C Slave Addresses
ADDR PIN
A6
A5
A4
A3
A2
A1
A0
7-BIT ADDRESS
WRITE
READ
GND
1
0
1
0
0
0
0
0x50
0xA0
0xA1
8870Ω to GND
1
0
1
0
0
0
1
0x51
0xA2
0xA3
15800Ω to GND
1
0
1
0
0
1
0
0x52
0xA4
0xA5
BIAS
1
0
1
0
0
1
1
0x53
0xA6
0xA7
I2C Protocol
Data is transferred MSB first with each data bit present on SDA sampled on every SCL clock pulse while the SDA line is stable. A byte of data on SDA contains 8 bits, MSB first, that can represent but is not limited to a register address or data written to the device. Additionally, SDA should never change while the SCL is high. There are two exceptions to this rule: the START condition and the STOP condition.
START Condition
Every I2C transaction between a master device and slave device begins with the master sending a START condition. The I2C master generates a START condition by first detecting when the I2C bus is idle, and then asserting the SDA signal low while allowing SCL to remain pulled high.
STOP Condition
An I2C STOP condition is created whenever an I2C master produces a rising edge on SDA while SCL remains high. This terminates any transaction with a slave device and frees up the I2C bus. SDA and SCL idle high when the I2C bus is not busy. The bus remains active if a REPEATED START (RS) condition is generated instead of a STOP condition.
Figure 21. START and STOP Conditions
REPEATED START Condition
An I2C REPEATED START condition is created when an I2C master produces a second START during a transaction with a slave device. REPEATED STARTs are needed to signal the slave device that the master desires a change in data direction during a transaction. The REPEATED START is sent after the acknowledge bit (ACK).
Figure 22. REPEATED START Condition
Acknowledge Bit (ACK)
ACK is a clocked 9th bit that the device uses to handshake receipt each byte of data. The device pulls down SDA during the master-generated 9th clock pulse. The SDA line must remain stable and low during the high period of the acknowledge clock pulse. Monitoring ACK allows for detection of unsuccessful data transfers. An unsuccessful data transfer occurs if a receiving device is busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the I2C master can reattempt communication.
Clock Stretching
In general, the clock signal generation for the I2C bus is the responsibility of the master device. The I2C specification allows slow slave devices to alter the clock signal by holding down the clock line. The process in which a slave device holds down the clock line is typically called clock stretching. The MAX25432 does not use any form of clock stretching to hold down the clock line.
General Call Address
The MAX25432 does not implement the I2C specification “general call address.” If the MAX25432 sees the general call address (0b0000_0000), it will not issue an acknowledge.
I2C Transactions
The MAX25432 supports several types of I2C transactions, described as follows.
Read Byte
The master Read Byte transaction begins with the master sending a START condition. This is followed by a 7-bit address and R/W bit = 0, indicating a master write operation. If this address matches the MAX25432 device address, the device will acknowledge (ACK) by holding the SDA line low for one SCL clock. The master then sends the byte address, which serves as a pointer to the MAX25432 device register where data will be read. The MAX25432 again ACKs the byte sent. Then, the master sends a REPEATED START condition, alerting the MAX25432 device that the next byte will again be an address. The master device clocks in the MAX25432 address, this time appended with a logic ‘1’. This signals the MAX25432 that the master wants to read the data from the register address previously sent. The MAX25432 again ACKs the byte sent. On the rising of the next SCL clock, the slave begins sending the desired data byte to the master. The master will then signal the MAX25432 that the previous byte was the final byte needed by not acknowledging (NACK), followed by a STOP condition, indicating the end of the Read Byte transaction.
When the I2C master desires to read data from two or more MAX25432 registers that are not contiguously located, sequential Read Byte transactions must be used. For instance, two bytes of data can be read from the MAX25432, one at register address 0x1E and the other at register address 0x20, however the I2C bus is released (STOP condition) between read operations. The MAX25432 will ACK its address and data bytes sent by the master. It expects the master to NACK the last data byte prior to sending a STOP condition.
Figure 23. Read Byte
Write Byte
The master Write Byte transaction begins with the master sending a START condition. This is followed by a 7-bit address and R/W bit = 0, indicating a master write operation. If this address matches the MAX25432 device address, it will ACK by holding the SDA line low for one SCL clock. The master then sends the register address, which serves as a pointer to the MAX25432 register where data will be written. The MAX25432 again ACKs the byte sent. Then the master sends the data byte and waits for the MAX25432 to ACK the data byte. Finally, the I2C master terminates the transaction by sending a STOP condition.
When it is desired to write data to two or more non-contiguous MAX25432 registers, sequential Master Write transactions should be used. The MAX25432 will acknowledge its address and data bytes sent by the master. A master STOP condition terminates each write.
Figure 24. Write Byte
Read Word
The master Read Word transaction follows the same sequence as the master Read Byte except that two data bytes are received from the MAX25432, a low-address data byte (DATA n) followed by a high-address data byte (DATA n+1). This is accomplished by ACKing the first data byte received from the slave device, and then NACKing the second data byte, followed by sending a STOP condition. Note that the MAX25432 automatically increments the register pointer to the next address. Reading ALERT_L and ALERT_H registers in a single operation is an example of using the Read Word transaction.
Figure 25. Read Word
Write Word
The master Write Word transaction is similar to a master Write Byte except that data is written to two sequential MAX25432 registers in one operation. The transaction begins exactly as a master Write Byte transaction; namely a START condition, the Slave Address followed by a write bit, then the Register Address. However, two data bytes are then sent—a low-address data byte (DATA n) followed by a high-address data byte (DATA n+1). The MAX25432 ACKs each byte received, and automatically increments the register address pointer between the low and high data bytes. Finally, the master sends a STOP condition to complete the transaction. Note that the low and high data bytes follow the same bit order as the previous bytes (Slave and Register addresses) which is MSB first (D7 to D0). Once the data is received, the I2C master will need to flip the bit order and concatenate to obtain a 16-bit word with LSB first.
Figure 26. Write Word
Read Block
The master Read Block transaction is a powerful function, enabling the I2C master to read from 1 to 255 bytes of data from contiguous MAX25432 registers in one operation. Note that I2C Read operations from the MAX25432B's TCPC Receive Buffer require this type of I2C transaction for proper operation.
Figure 27. Read Block
The master Read Block transaction begins as any I2C Read operation, first the master sends a START condition, followed by the MAX25432’s 7-bit device address plus the R/W bit = 0. The MAX25432 will ACK its address, then the master sends the register address for the beginning of the contiguous block where data is to be read from. The MAX25432 again ACKs the received data. Next, the master sends a REPEATED START condition, informing the MAX25432 that the next byte sent will be an address. The I2C master then sends the MAX25432’s 7-bit device address plus the R/W bit = 1, configuring the MAX25432 I2C for slave read operation. The MAX25432 again acknowledges its address and prepares to deliver data from its registers.
The master can now read up to 255 bytes of data from the MAX25432 by continuing to clock the SCL signal. The MAX25432 will output data on SDA, one byte for each 8 SCL clocks, and expect that the master ACK the data sent on the 9th SCL clock. The MAX25432 will automatically increment the register address pointer between successive bytes. When the desired number of bytes from the MAX25432 has been sent, the master must send a NACK followed by a STOP condition to terminate the transaction.
Write Block
The MAX25432 also supports I2C block data writes for up to 255 contiguous registers. The MAX25432B’s transmit buffer requires this type of I2C transaction for proper operation.
Figure 28. Write Block
The master Write Block transaction begins by sending a START condition, followed by the MAX25432’s 7-bit device address plus the R/W bit = 0. The MAX25432 will ACK its address, then the master sends the register address for the beginning of the contiguous block where data will be written. The MAX25432 again ACKs the received data.
The master can now write up to 255 bytes of data to the MAX25432 by continuing to clock the SCL signal. The MAX25432 will store data from SDA, one byte for each eight SCL clocks, and will ACK the data sent on the 9th SCL clock. The MAX25432 automatically increments the register address pointer between successive bytes. When the desired number of bytes from the MAX25432 has been sent, the master sends a STOP condition to terminate the transaction.
Watchdog Timer
The MAX25432 implements a programmable watchdog timer to give the design engineer the ability to monitor the I2C interface for lack of communication from the I2C master. The watchdog provides a fail-safe mechanism in case the TCPM software stack or PD controller firmware hangs in a state where, for instance, a voltage is sourced on VBUS when the sink is no longer attached.
The watchdog timer functionality is enabled by setting TCPC_CONTROL.EN_WD_TMR to logic '1'. The watchdog timer starts when the ALERT pin is asserted. The watchdog timer is cleared on any I2C access by the I2C master (either Read or Write). If the ALERT pin is still asserted after this I2C access, the watchdog timer reinitializes and start monitoring again until the ALERT pin is deasserted.
If the I2C master is unable to clear the watchdog timer within the programmed time set in WATCHDOG_SETUP.WD_TIMEOUT[1:0], it causes the watchdog timer to expire. When the watchdog timer expires, the MAX25432 immediately disconnects the CC terminations by setting ROLE_CONTROL[3:0] to 1111b, discharge VBUS to vSafe0V, and then set FAULT_STATUS.I2C_ERR bit. The MAX25432 will remove the VBUS discharge circuit when VBUS is below vSafe0V and it will not reapply the discharge circuit if VBUS rises above vSafe0V. Stop discharge in this case is an edge-triggered event.
Any further changes on VBUS need to be initiated by the I2C master when its communication link with the MAX25432 is restored.
Transmitting and Receiving a Hard Reset (MAX25432B only)
To transmit a Hard Reset, write 0x05 to the TRANSMIT[7:0] register.
Upon receiving a Hard Reset from the port partner, the MAX25432B will set the RX_HARD_RST flag in the ALERT_L[7:0] register.
Upon sending or receiving a Hard Reset, the MAX25432B resets the following registers to their default values:
RECEIVE_DETECT[7:0]
ALERT_MASK_L_SEL[7:0]
ALERT_MASK_H_SEL[7:0]
POWER_STATUS_MASK[7:0]
EXTENDED_STATUS_MASK[7:0]
ALERT_EXTENDED_MASK[7:0]
Built-In Self-Test (BIST)
The MAX25432B supports BIST Carrier Mode 2 and BIST Test Data Mode per USB PD Revision 3.0 Version 1.2.
Transmitting BIST Carrier mode 2
Upon receiving a BIST data object (BDO) with the BIST type set to Carrier mode, the TCPM writes 0x07 to the TRANSMIT[7:0] register to enable BIST Carrier mode 2.
Immediately after, the MAX25432B transmits the BIST pattern for 50ms (typ) on the HVCC line corresponding to the orientation defined by the PLUG_ORNT bit.
At the end of the 50ms timer, the MAX25432B asserts ALERT and flags the TX_SOP_MSG_SUCC bit.
After reading this flag, the TCPM should enter the PE_SRC_Transition_to_default state.
Entering/exiting BIST Test Data mode
Upon receiving a BDO with the BIST type set to Test Data, the TCPM sets the BIST_TM bit in the TCPC_CONTROL[7:0] register to enable BIST Test Data mode.
See the BIST_TM bit description for information on this mode.
The TCPM must clear the BIST_TM bit upon receiving a Hard Reset in order to exit this mode.