| 1 |
SPS |
Spread-Spectrum Enable. Connect logic-high to enable spread spectrum of internal oscillator or logic-low to disable spread spectrum. This pin has a 1MΩ internal pulldown. |
| 2 |
EN |
High-Voltage-Compatible Enable Input. If this pin is low, the part is off. |
| 3 |
BST |
Bootstrap Pin for HS Driver. It is recommended to use 0.1μF from BST to LX. |
| 4 |
SUP |
Supply Input. Connect a 4.7μF ceramic capacitor from SUP to PGND. |
| 5 |
LX |
Buck Switching Node. High impedance when part is off. Connect a 4.7μH inductor between LX and OUT. |
| 6 |
PGND |
Power Ground. Ground return path for all high-current/high-frequency noisy signals. |
| 7 |
AGND |
Analog Ground. Ground return path for all ‘quiet’ signals. |
| 8 |
FB |
Feedback Pin. Connect a resistor-divider from OUT to FB to ground for external adjustment of the output voltage (MAX25231ATCD only). Connect to bias for internal fixed voltage configurations. |
| 9 |
OUT |
Buck Regulator Output-Voltage-Sense Input. Bypass OUT to PGND with 22μF ceramic capacitor. |
| 10 |
BIAS |
5V Internal BIAS Supply. Connect a 1μF (min) ceramic capacitor to AGND. |
| 11 |
SYNC |
Sync Input. If connected to ground or open, skip-mode operation is enabled under light loads; if connected to BIAS, forced-PWM mode is enabled. This pin has a 1MΩ internal pulldown. |
| 12 |
PGOOD |
Open-Drain Reset Output. External pullup required. |
| - |
EP |
Exposed Pad. EP must be connected to ground plane on PCB, but is not a current-carrying path and is only needed for thermal transfer. |
