Absolute Maximum Ratings
- SUP-0.3V to +40V
- EN-0.3V to VSUP + 0.3V
- BST to LX (Note 1)+6V
- BST-0.3V to +45V
- FB-0.3V to VBIAS + 0.3V
- SYNC-0.3V to VBIAS + 0.3V
- SPS-0.3V to VBIAS + 0.3V
- OUT-0.3V to +12V
- OUT (MAX25231AFOD)-0.3V to +12V
- PGOOD-0.3V to +6V
- PGND to AGND-0.3V to +0.3V
- BIAS-0.3V to +6V
- OUT Short-Circuit DurationContinuous
- ESD Protection
- Continuous Power Dissipation (TA = +70°C)
- 12-pin TDFN/SW TDFN
- (derate 24.4mW/°C above +70°C)1951mW
- Operating Junction Temperature (Note 4)-40ºC to +150ºC
- Storage Temperature Range-65ºC to +150ºC
- Junction Temperature+150ºC
- Lead Temperature (Soldering, 10s)+300ºC
- Soldering Temperature (Reflow)+260ºC
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Note 1:
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LX has internal clamp diodes to PGND/AGND and SUP. Applications that forward bias these diodes should take care not to exceed the IC’s package power-dissipation limits. |
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.