1 |
VPROG |
Programming Voltage. Apply a voltage of 8.5V to this pin during the programming of non-volatile registers. Connect to GND through a resistor during normal operation. |
2 |
LXN |
DC-DC Inverting Converter Inductor/Diode Connection. |
3 |
INN |
Inverting Converter Input. Connect 10μF + 0.1μF ceramic capacitors from this pin to ground for proper operation. |
4 |
VCB |
Drive Output for External npn Pass Transistor for VCOMN regulator. Connect to the base of the external npn transistor. |
5 |
VCOM |
Output of VCOM amplifier. |
6 |
VCOMN |
Negative Supply for VCOM Buffer. Connect a ceramic capacitor of at least 1μF from VCOMN to GND. |
7 |
IN |
Supply Connection for Display Bias Circuitry. Bypass IN with local 10μF and 0.1μF capacitors. |
8 |
EN |
Enable Input Pin. When EN is low, the device is in shutdown. When EN is taken high, the device is active. In stand-alone mode, the outputs are turned on in the stored sequence when EN goes high. |
9 |
ADD |
Device Address Select pin. Connect to GND or V18 to Select the Device I2C Address. See the I2C address table. To use stand-alone mode (without I2C) leave the ADD pin open. In this mode, the device turns on all outputs in the programmed sequence when EN is taken high. |
10 |
V18 |
Output of Internal 1.8V Regulator. Connect a 1μF capacitor from V18 to GND. |
11 |
GND |
Ground Connection
|
12 |
BST |
Bootstrap Capacitor Connection for Synchronous Rectifier Driver. Connect a 0.1μF ceramic capacitor between BST and LXP. |
13 |
PGND |
Ground Connection for Boost Switching Device and VCOM Buffer. Connect to GND using a low-impedance trace. |
14 |
LXP |
Switching Node of Boost Converter. Connect the boost inductor between LXP and IN. |
15 |
HVINP |
Boost Output and Input to Positive and Negative Charge-Pump Drivers. Bypass HVINP with a 10μF output capacitor placed close to the pin. |
16 |
AVDD |
Switched Output of Boost Converter. Connect a bypass capacitor of value 2.2μF from AVDD to PGND. |
17 |
PGVDD |
Supply Voltage for Positive Charge Pump. PGVDD is connected to HVINP by means of an internal switch when the positive charge pump is enabled. Bypass PGVDD with a ceramic capacitor of 1μF to GND. |
18 |
FC2+ |
Positive Connection for Second Flying Capacitor. Connect a 22nF capacitor from FC2- to FC2+. |
19 |
FC2- |
Negative Connection for Second Flying Capacitor. Connect a 22nF capacitor from FC2- to FC2+. |
20 |
FC1+ |
Positive Connection for First Flying Capacitor. Connect a 22nF capacitor from FC1- to FC1+. |
21 |
FC1- |
Negative Connection for First Flying Capacitor. Connect a 22nF capacitor from FC1- to FC1+. |
22 |
VGON |
Output of Positive Charge-Pump Block. Connect a 1μF capacitor from VGON to GND. |
23 |
CPGND |
Ground Connection for Charge Pumps. |
24 |
VGOFF |
Output of Negative Charge-Pump Block. Connect a 1μF capacitor from this pin to GND. |
25 |
DN |
Negative Charge-Pump Push-Pull Drive Output. |
26 |
SDA |
Bidirectional I2C Data Pin. |
27 |
SCL |
I2C Clock Pin. |
28 |
FLTB |
Open-Drain, Active-Low Fault Output. Connect a pullup resistor from FLTB to a logic supply ≤5V. In stand-alone mode, the duty cycle of the FLTB pin indicates an error condition, if present (see Table 4). When the serial interface is used, FLTB is either a 0 (indicating data to be read from the internal registers) or a 1. |
29 |
RREF |
Reference Resistor Pin. When using the temperature compensation function, connect a resistor from RREF to GND. If unused, leave RREF unconnected. |
30 |
TEMP |
Temperature Sensor Pin. When using the temperature compensation function, connect an NTC from TEMP to GND. If unused, leave TEMP unconnected. |
31 |
DGND |
Logic Ground. |
32 |
NAVDD |
Negative Source-Driver Output Voltage. Connect ceramic capacitors of value 0.1μF and 10μF from this pin to GND with the smallest capacitor closest to the pin. |