The MAX25210 features an exposed thermal pad on its underside that should be used as a heatsink. This pad lowers the package’s thermal resistance by providing a direct heat-conduction path from the die to the PCB. Connect the exposed pad and GND to the system ground using a large pad or ground plane, or multiple vias to the ground plane layer.
The reset timeout period is adjustable to accommodate a variety of microprocessor applications. Adjust the reset timeout period by connecting a capacitor between TIMEOUT and GND.
tRP = (1.25× CTIMEOUT)/ITO
where tRP is in ms and CTIMEOUT is in nF. Leave TIMEOUT unconnected to select the internally fixed timeout period. CTIMEOUT must be a low-leakage (< 10nA) type capacitor. Ceramic capacitors are recommended. To avoid the influence of parasitic capacitances, do not use capacitor values lower than 100pF.