Absolute Maximum Ratings- VDDL to GNDL-0.3V to 6V
- VDDPL to GNDL-0.3V to 6V
- SDI, CS, INT (To GNDL)-0.3V to 6V
- SDO, COUT_ (To GNDL)-0.3V to (VDDL + 0.3V)
- VDDF to GNDF-0.3V to 6V
- REF, AIN_ to AGND-0.3V to 2V
- AGND to GNDF-0.3V to 0.3V
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, derate 14.1mW/°C above +70°C. 16-pin Wide SOIC)1127mW
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, derate 11.9mW/°C above +70°C. 20-pin SSOP)964mW
- Continuous Power Dissipation (Multilayer Board) (TA = +70°C, derate 6.96mW/°C above +70°C. 28-pin SSOP)556.72mW
- Operating Temperature Range-40°C to +125°C
- Maximum Junction Temperature+150°C
- Storage Temperature Range-65°C to +150°C
- Lead Temperature (soldering, 10s)+300°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.