| Package Code | U8+1 |
| Outline Number | 21-0036 |
| Land Pattern Number | 90-0092 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | |
| Junction to Ambient (θJA) | 206.3°C/W |
| Junction to Case (θJC) | 42°C/W |
| Package Code | S8+2C |
| Outline Number | 21-0041 |
| Land Pattern Number | 90-0096 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | |
| Junction to Ambient (θJA) | 136°C/W |
| Junction to Case (θJC) | 38°C/W |
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
data-opMAX22506EASA%2B
data-opMAX22506EAUA%2B
data-opMAX22506EASA%2BT
data-opMAX22506EAUA%2BT
Receiver Output. See the Receiving Table for more information.Receiver Enable. Pull RE high to disable the receiver and three-state RO. The device is in low-power shutdown when RE = high and DE = low.Driver Output Enable. Force DE high to enable the driver. The device is in low-power shutdown when RE = high and DE = low.Driver Input. See the Transmitting Table for more information.GroundNoninverting Driver Output/Receiver InputInverting Driver Output/Receiver InputSupply Input. Bypass VCC to ground with a 0.1μF ceramic capacitor as close to the device as possible.