Absolute Maximum Ratings- VDDA to GNDA-0.3V to +6V
- VDDB to GNDB-0.3V to +6V
- IN_ on Side A to GNDA-0.3V to +6V
- IN_ on Side B to GNDB-0.3V to +6V
- OUT_ on Side A to GNDA-0.3V to (VDDA + 0.3)V
- OUT_ on Side B to GNDB-0.3V to (VDDB + 0.3)V
- Short-Circuit Continuous Current
- OUT_ on Side A to GNDA±30mA
- OUT_ on Side B to GNDB±30mA
- Continuous Power Dissipation (TA = +70°C)
- Narrow SOIC (derate 5.79mW/°C above +70°C)462.96mW
- Wide SOIC (derate 11.35mW/°C above +70°C)908.06mW
- Temperature Ratings
- Operating Temperature Range-40°C to +125°C
- Maximum Junction Temperature+150°C
- Storage Temperature Range-60°C to +150°C
- Lead Temperature (soldering, 10s)+300°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.