Absolute Maximum Ratings
- HP to HN-0.3V to +28.0V
- HP to GND-0.3V to +28.0V
- HN to GND-6.0V to +6.0V
- HPA to CAPP-0.3V to +6.0V
- CAPN to HNA-0.3V to +6.0V
- VRAW, EN to GND-0.3V to +28.0V
- VCC to GND-0.3V to +6.0V
- AIO, BIO, TERM, SRA to GND-0.3V to VCC+0.3V
- DIN, DOUT, RST, TVL, TVT, HPEN to GND-0.3V to +6.0V
- Continuous Current Into Any Pin
- HP, HN, VRAW, GND±250mA
- VCC, AIO, BIO, TERM±100mA
- CAPP, CAPN±10mA
- All Other Pins±50mA
- Continuous Power Dissipation
- Single-Layer Board (TA = +70°C, derate 20.8mW/°C above +70°C)1666.70mW
- Multilayer Board (TA = +70°C, derate 27.8mW/°C above +70°C)2222.20mW
- Operating Temperature Range-40°C to +105°C
- Junction Temperature+150°C
- Storage Temperature Range-40°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.