Absolute Maximum Ratings

Absolute Maximum Ratings
  • AVDD to AGND-0.3V to +3.9V
  • DVDD to DGND-0.3V to +3.9V
  • AGND to DGND-0.3V to +0.3V
  • AGND_DAC to AGND-0.3V to +0.3V
  • AGND_DAC to DGND-0.3V to +0.3V
  • AVDD to REF_DAC_EXT-0.3V to +3.9V
  • BYP_ADC to DGND-0.3V to +2.1V
  • HVDD to HVSS-0.3V to +52V
  • HVDDO to HVSSO-0.3V to +52V
  • HVDD to AGND-0.3V to +40V
  • HVDDO to AGND-0.3V to +40V
  • AGND to HVSS-0.3V to +40V
  • AGND to HVSSO-0.3V to +40V
  • HVSSO to HVSS-0.3V to +40V
  • AI_ to HVSS-0.3V to the lower of +52V or ((VHVDD-VHVSS)+0.3V)
  • HART_IN, FB to HVSSO-0.3 to the lower of +52V or ((VHVDDO-VHVSSO)+0.3V)
  • INT to DGND-0.3V to +6V
  • CS, SCLK, SDI, SDO, RDY, RST, SYNC, CLK, LDAC, GPIO_ to DGND-0.3 to the lower of +3.9V or (VDVDD+0.3V)
  • REF_ADC, REF_DAC, AUX1, AUX2, REF_ADC_EXT, REF_DAC_EXT, NR, REF_OUT, BYP_DAC to AGND-0.3 to the lower of +3.9V or (VAVDD+0.3V)
  • AON to HVSS-0.3V to +80V
  • AOP to HVDDO-70V to +0.3V
  • AON to HVSSO-0.3V to +70V
  • Maximum Current into AOP, AON±100mA
  • Maximum Current into Any Other Pin±50mA
  • Continuous Power Dissipation (TA = +70°C)
    • 64-Pin LGA (derate 42.8mW/°C over TA = +70°C)3418.8mW
  • Operating Temperature Range-40°C to +125°C
  • Junction Temperature+150°C
  • Storage Temperature Range-65°C to +150°C
  • Soldering Temperature (reflow)+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.