Absolute Maximum Ratings
- IN, OUT, SDA, SCL, EN, FAST, RSEL,
- PGOOD, INGOOD, INT, CAP-0.3V to +6.0V
- LVLX-0.3V to VIN + 0.3V
- HVLX-0.3 to min(VOUT + 0.3V, +6.0V)
- Continuous Power Dissipation (Multilayer Board,
- TA = +70°C) (4 x 4 Array 16-Ball, 1.77mm x 2.01mm, 0.4mm
- Pitch WLP) (derate 17.26mW/°C above +70°C)1380.80mW
- Continuous Power Dissipation (Multilayer Board,
- TA = +70°C) (12-Pin, 2.50mm x 2.50mm, 0.5mm Pitch
- FC2QFN) (derate 17.04mW/°C above +70°C)1363.20mW
- Operating Temperature Range
- MAX20343-40°C to +85°C
- MAX20344-40°C to +125°C
- Junction Temperature+150°C
- Storage Temperature Range-40°C to +150°C
- Soldering Temperature (reflow)+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.