Pin Specifications

Pin Description
PIN	NAME	FUNCTION
A1, A2, A3, A4	15,16	IN	Supply Voltage Input. IN is connected to the drain of internal MOSFET. Apply at least 1µF capacitor at IN. Bypass IN with a transient voltage-suppressor diode to GND for clamping inductive transients in the case of fast output short event.
B3, B4	19, 20	OUT1	Power Output 1. Source of the internal power MOSFET1. In parallel mode It shall be connected to OUT2 to scale the current capability.
B1, B2	11, 12	OUT2	Power Output 2. Source of the internal power MOSFET2. In parallel mode, it should be connected to OUT1 to scale the current capability.
D3	3	IMON1	Current Limit Threshold Setting and Current Monitor Output for Channel 1. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.
D1	5	IMON2	Current Limit Threshold Setting and Current Monitor Output for Channel 2. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.
C4	24	EN1	Active-High Enable Input 1. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 1.
C3	1	EN2	Active-High Enable Input 2. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 2.
C1	7	ALRT1	ALRT1 Status Output for Channel 1. Open-drain output. ALRT1 pin de-asserts when the channel 1 MOSFET is fully turned on. ALRT1 pin asserts when these events occur—output 1 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT1 unconnected if unused.
C2	6	ALRT2	ALRT2 Status Output for Channel 2. Open-drain output. ALRT2 pin de-asserts when the channel 2 MOSFET is fully turned on. ALRT2 pin asserts when these events occur—output 2 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT2 unconnected if unused.
D4	2	DLY	Overcurrent Shutdown Delay Setting. Connect a resistor to GND to configure shut down delay to be 12µs, 100µs, 1ms, 10ms in current limit event.
D2	4	GND	Ground.
—	—	EP	Exposed Pad. Connect EP to a large GND plane with several thermal vias for best thermal performance. Refer to the MAX15162 EV kit data sheet for a reference layout design.

A1, A2, A3, A4

15,16

IN

Supply Voltage Input. IN is connected to the drain of internal MOSFET. Apply at least 1µF capacitor at IN. Bypass IN with a transient voltage-suppressor diode to GND for clamping inductive transients in the case of fast output short event.

B3, B4

19, 20

OUT1

Power Output 1. Source of the internal power MOSFET1. In parallel mode It shall be connected to OUT2 to scale the current capability.

B1, B2

11, 12

OUT2

Power Output 2. Source of the internal power MOSFET2. In parallel mode, it should be connected to OUT1 to scale the current capability.

D3

3

IMON1

Current Limit Threshold Setting and Current Monitor Output for Channel 1. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.

D1

5

IMON2

Current Limit Threshold Setting and Current Monitor Output for Channel 2. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.

C4

24

EN1

Active-High Enable Input 1. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 1.

C3

1

EN2

Active-High Enable Input 2. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 2.

C1

7

ALRT1

ALRT1 Status Output for Channel 1. Open-drain output. ALRT1 pin de-asserts when the channel 1 MOSFET is fully turned on. ALRT1 pin asserts when these events occur—output 1 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT1 unconnected if unused.

C2

6

ALRT2

ALRT2 Status Output for Channel 2. Open-drain output. ALRT2 pin de-asserts when the channel 2 MOSFET is fully turned on. ALRT2 pin asserts when these events occur—output 2 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT2 unconnected if unused.

D4

2

DLY

Overcurrent Shutdown Delay Setting. Connect a resistor to GND to configure shut down delay to be 12µs, 100µs, 1ms, 10ms in current limit event.

D2

4

GND

Ground.

—

EP

Exposed Pad. Connect EP to a large GND plane with several thermal vias for best thermal performance. Refer to the MAX15162 EV kit data sheet for a reference layout design.

PIN		NAME	FUNCTION
16 WLP	24 TQFN	NAME	FUNCTION
A1, A2, A3, A4	15,16	IN	Supply Voltage Input. IN is connected to the drain of internal MOSFET. Apply at least 1µF capacitor at IN. Bypass IN with a transient voltage-suppressor diode to GND for clamping inductive transients in the case of fast output short event.
B3, B4	19, 20	OUT1	Power Output 1. Source of the internal power MOSFET1. In parallel mode It shall be connected to OUT2 to scale the current capability.
B1, B2	11, 12	OUT2	Power Output 2. Source of the internal power MOSFET2. In parallel mode, it should be connected to OUT1 to scale the current capability.
D3	3	IMON1	Current Limit Threshold Setting and Current Monitor Output for Channel 1. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.
D1	5	IMON2	Current Limit Threshold Setting and Current Monitor Output for Channel 2. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.
C4	24	EN1	Active-High Enable Input 1. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 1.
C3	1	EN2	Active-High Enable Input 2. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 2.
C1	7	ALRT1	ALRT1 Status Output for Channel 1. Open-drain output. ALRT1 pin de-asserts when the channel 1 MOSFET is fully turned on. ALRT1 pin asserts when these events occur—output 1 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT1 unconnected if unused.
C2	6	ALRT2	ALRT2 Status Output for Channel 2. Open-drain output. ALRT2 pin de-asserts when the channel 2 MOSFET is fully turned on. ALRT2 pin asserts when these events occur—output 2 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT2 unconnected if unused.
D4	2	DLY	Overcurrent Shutdown Delay Setting. Connect a resistor to GND to configure shut down delay to be 12µs, 100µs, 1ms, 10ms in current limit event.
D2	4	GND	Ground.
—	—	EP	Exposed Pad. Connect EP to a large GND plane with several thermal vias for best thermal performance. Refer to the MAX15162 EV kit data sheet for a reference layout design.