Package Information

WLP

Package Code	W161M1+1
Outline Number	21-100353
Land Pattern Number	Refer to Application Note 1891
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ_JA)	49°C/W
Junction to Case (θ_JC)	9.45°C/W

24 TQFN

Package Code	T2444+2C
Outline Number	21-0139
Land Pattern Number	90-0020
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ_JA)	39°C/W
Junction to Case (θ_JC)	6°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

data-opMAX15162AATG%2BT

data-opMAX15162ATG%2B

data-opMAX15162ATG%2BT

data-opMAX15162AATG%2B

data-opMAX15162AWE%2BT

data-opMAX15162AAWE%2B

data-opMAX15162AWE%2B

data-opMAX15162AAWE%2BT

Supply Voltage Input. IN is connected to the drain of internal MOSFET. Apply at least 1µF capacitor at IN. Bypass IN with a transient voltage-suppressor diode to GND for clamping inductive transients in the case of fast output short event.Power Output 1. Source of the internal power MOSFET1. In parallel mode It shall be connected to OUT2 to scale the current capability.Power Output 2. Source of the internal power MOSFET2. In parallel mode, it should be connected to OUT1 to scale the current capability.Current Limit Threshold Setting and Current Monitor Output for Channel 1. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.Current Limit Threshold Setting and Current Monitor Output for Channel 2. This pin sources a scaled-down internal MOSFET current. Connect a resistor to GND to set current limit threshold between 0.5A and 1.5A, and convert current to voltage for current motoring. This pin can not be floating.Active-High Enable Input 1. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 1.Active-High Enable Input 2. Internally pulled up to 2V. The pin can be also externally pulled up to logic-high state to enable the output 2.ALRT1 Status Output for Channel 1. Open-drain output. ALRT1 pin de-asserts when the channel 1 MOSFET is fully turned on. ALRT1 pin asserts when these events occur—output 1 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT1 unconnected if unused.ALRT2 Status Output for Channel 2. Open-drain output. ALRT2 pin de-asserts when the channel 2 MOSFET is fully turned on. ALRT2 pin asserts when these events occur—output 2 is disabled, current limit event, overtemperature event, startup watchdog timer times out, startup configuration fault. Leave ALRT2 unconnected if unused.Overcurrent Shutdown Delay Setting. Connect a resistor to GND to configure shut down delay to be 12µs, 100µs, 1ms, 10ms in current limit event.Ground.Exposed Pad. Connect EP to a large GND plane with several thermal vias for best thermal performance. Refer to the MAX15162 EV kit data sheet for a reference layout design.