Package Information

Package Information
20-Pin TQFN
Package Code T2044+4
Outline Number 21-0139
Land Pattern Number 90-0429
Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 48°C/W
Junction to Case (θJC) 2°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 33°C/W
Junction to Case (θJC) 2°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

data-opMAX11947GTP%2B
data-opMAX11947GTP%2BT
Modem Rx Digital Signal OutputDirection Output. DIR is asserted high when the data stream is seen at the receiver.Logic Supply VoltageModem Tx Digital Signal InputSync Output. Open-drain output of the 8.704MHz clock to synchronize other devices.GroundSPI Bus Serial Data InputSPI Bus Serial Data OutputSPI Bus Serial Clock InputActive-Low, SPI Bus Chip EnableRF MUX Port 3 RF MUX Port 2GroundRF MUX Port 1RF MUX Port 0Analog Supply VoltageOutput Bias Reference. Decouple BIAS with 1μF to GND.External Crystal Input Terminal. Feed with 8.704MHz (±30ppm) input clock for external synchronization.External Crystal Input Terminal. Connect to GND for external synchronization.Exposed Pad. Must be left open or connected to GND.