Absolute Maximum Ratings

Absolute Maximum Ratings
  • VCC to GND-0.3V to +6V
  • VL to GND-0.3V to +6V
  • P0, P1, P2, P3, XTAL1, XTAL2, BIAS, SYNCOUT to GND-0.3V to +6V
  • TXIN, RXOUT, DIR, SDI, SDO, SCLK, CSB to GND-0.3V to (VL +0.3)V
  • Output Short-Circuit Current P_ While Transmitting, SYNCOUT to VCC or GNDContinuous
  • All Other Pins Max In/Out Current±20mA

  • Continuous Power Dissipation (TA = +70°C)

    20-pin TQFN (derate 30.2mW/°C)    2415mW
  • Operating Temperature Range-40°C to +105°C
  • Junction Temperature+150°C
  • Storage Temperature Range-65°C to +150°C
  • Lead Temperature (soldering, 10s)+300°C
  • Soldering Temperature (reflow)+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.