|
POWER
|
| 1 |
CEXT |
External Capacitor. Connect to ground through a 1µF external ceramic chip capacitor. Place the capacitor as close as possible to the CEXT pin. No other components should be connected to the CEXT pin. |
| 6 |
GND |
Digital Ground. Connect directly to the ground plane. |
| 7 |
PDWN |
Power Down. Controls the power state of the DS28S60. Setting this pin to GND places the DS28S60 into power-down mode. In power-down mode, all volatile/ephemeral registers and data are erased. Set this pin high prior to communicating with the device. This pin should remain in a high state for the duration of any cryptography computations and as long as any ephemeral data/keys are required by the host application. |
| 12 |
VDD |
Supply Voltage. Connect to the external power supply for the DS28S60. Bypass to ground with a 4.7μF and 0.1μF capacitor in parallel as close as possible to the VDD pin. |
| — |
EP |
Exposed Pad. Solder evenly to the board's ground plane for proper operation. Refer to Application Note 3273: Exposed Pads: A Brief Introduction for additional information. |
|
SPI SLAVE
|
| 2 |
SPIS_SCK |
Slave Clock (SCK). The SPI clock input from an external SPI master controller. |
| 3 |
SPIS_MOSI |
Master Out Slave In (MOSI). This is the SPI data input line from the SPI master. |
| 4 |
SPIS_MISO |
Master In Slave Out (MISO). This is the SPI data output line for data going from the DS28S60 to an external SPI master. |
| 5 |
SPIS_SS |
Slave Select (SS). An input from a SPI master to select the DS28S60 for communication. |
| 8–11 |
DNC |
Do Not Connect. Leave unconnected. |
