Absolute Maximum Ratings
- VDD-0.3V to +6V
- CANH or CANL (Continuous)-65V to +65V
- TXD, RXD, STBY, S, LPBK, FAULT-0.3V to +6V
- VL MAX33014E/15E-0.3V to (VDD + 0.5V)
- Short-Circuit DurationContinuous
- Continuous Power Dissipation
- 8 SO Single-Layer Board (TA = +70°C, derate 5.9mW/°C above +70°C.)470.6mW
- 8 SO Multilayer Board (TA = +70°C, derate 7.6mW/°C above +70°C.)606.1mW
- 10 TDFN Single-Layer Board (TA = +70°C, derate 18.5mW/°C above +70°C.)1481.5mW
- 10 TDFN Multilayer Board (TA = +70°C, derate 24.4mW/°C above +70°C.)1951.2mW
- Operating Temperature Range-40°C to +125°C
- Junction Temperature+150°C
- Storage Temperature Range-60°C to +150°C
- Soldering Temperature (reflow)+260°C
- Lead Temperature (soldering, 10sec)+300°C
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Note 1:
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All voltages are referenced to GND, unless otherwise noted. |
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Note 2:
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Package thermal resistances were obtained using the method described in JEDEC specification JEDSD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. |
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.